Method for producing wiring substrate

Patent metadata

Field	Value
Publication number	US-2021378103-A1
Application number	US-202117324194-A
Country	US
Kind code	A1
Filing date	May 19, 2021
Priority date	Jun 2, 2020
Publication date	Dec 2, 2021
Grant date	—

Abstract

The present disclosure provides a method for producing a wiring substrate. A seeded substrate is first prepared. The seeded substrate includes an insulation substrate, a conductive undercoat layer having a hydrophilic surface and provided on the insulation substrate, a conductive seed layer provided on a first region of the surface of the undercoat layer, the first region having a predetermined pattern, and a water-repellent layer on the second region of the surface of the undercoat layer, the second region being a region other than the first region. Subsequently, a metal layer is formed on the seed layer. A voltage is applied between the anode and the seed layer while a solid electrolyte membrane being disposed between the seeded substrate and the anode, and the solid electrolyte membrane and the seed layer being pressed into contact with each other. Thereafter, the water-repellent layer and the undercoat layer are etched.

First claim

What is claimed is:

1 . A method for producing a wiring substrate comprising an insulation substrate and a wiring layer having a predetermined wiring pattern and provided on the insulation substrate, the method comprising steps of:
(a) preparing a seeded substrate comprising:
the insulation substrate;
a conductive undercoat layer provided on the insulation substrate and having a hydrophilic surface;
a conductive seed layer provided on a first region of the surface of the undercoat layer, the first region having a predetermined pattern corresponding to the wiring pattern; and
a water-repellent layer provided on a second region of the surface of the undercoat layer, the second region being a region other than the first region;
(b) forming a metal layer on a surface of the seed layer, wherein a voltage is applied between an anode and the seed layer while a solid electrolyte membrane containing a metal ion-containing solution being disposed between the seeded substrate and the anode, and the solid electrolyte membrane and the seed layer being pressed into contact with each other; and (c) etching the water-repellent layer and the undercoat layer.

2 . The method according to claim 1 , wherein the step (a) comprises, in the sequence set forth:
forming the undercoat layer on the insulation substrate; forming the seed layer on the first region of the surface of the undercoat layer; and forming the water-repellent layer on the second region of the surface of the undercoat layer.

3 . The method according to claim 1 , wherein the step (a) comprises, in the sequence set forth:
forming the undercoat layer on the insulation substrate; forming the water-repellent layer on the second region of the surface of the undercoat layer; and forming the seed layer on the first region of the surface of the undercoat layer.

4 . The method according to claim 1 , wherein the undercoat layer has a hydroxyl group on its surface.

5 . The method according to claim wherein the step (a) comprises forming the water-repellent layer using organic silane or organic silazane.

Assignees

• Toyota Motor Co Ltd

Inventors

• Kondoh Haruki
• Mori Rentaro
• Yanagimoto Hiroshi
• Kuroda Keiji
• Okamoto Kazuaki

Classifications

• H10W70/05 Primary

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H05K2203/1173

  Differences in wettability, e.g. hydrophilic or hydrophobic areas · CPC title

• H05K3/108 Primary

  by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241) · CPC title

• C25D7/123

  Semiconductors first coated with a seed layer or a conductive layer · CPC title

• C25D3/38

  of copper · CPC title