Plate, plating apparatus, and method of manufacturing plate

Patent metadata

Field	Value
Publication number	US-2021355596-A1
Application number	US-202117314491-A
Country	US
Kind code	A1
Filing date	May 7, 2021
Priority date	May 12, 2020
Publication date	Nov 18, 2021
Grant date	—

Abstract

Provided is a plate that is arranged between a substrate and an anode in a plating tank. This plate has a plurality of circular pores on each one of at least three reference circles that are concentric with each other and that are different from each other in diameter. The plurality of circular pores include three circular pores that are arranged respectively on adjacent three of the at least three reference circles, and that have centers which are out of alignment with each other on an arbitrary radius on the plate.

First claim

What is claimed is:

1 . A plate that is arranged between a substrate and an anode in a plating tank, the plate having a plurality of circular pores on each one of at least three reference circles that are concentric with each other and that are different from each other in diameter,
the plurality of circular pores including three circular pores that are arranged respectively on adjacent three of the at least three reference circles, and that have centers which are out of alignment with each other on an arbitrary radius on the plate.

2 . The plate according to claim 1 ,
wherein the plurality of circular pores are arranged at an equal pitch along a circumferential direction of a corresponding one of the at least three reference circles.

3 . The plate according to claim 1 ,
wherein a difference between a diameter of an arbitrary one of the at least three reference circles and a diameter of adjacent another one of the at least three reference circles is constant.

4 . A plating apparatus, comprising:
the plate according to claim 1 ; and the plating tank that houses the plate.

5 . A method of manufacturing a plate that is arranged between a substrate and an anode in a plating tank, the plate having a plurality of circular pores, the method of manufacturing the plate comprising:
determining
a region radius being a radius of a region in which the plurality of circular pores are formed through the plate,
a pore diameter of the plurality of circular pores, and
a target porosity in the region of the region radius;
dividing the region into a plurality of annular divided regions having predetermined widths on the basis of the region radius, the pore diameter, and the target porosity; and forming the plurality of circular pores on a plurality of reference circles that are located respectively in the plurality of annular divided regions on the plate in a manner that three circular pores of the plurality of circular pores are arranged respectively on adjacent three of the plurality of reference circles, and that centers of the three circular pores are out of alignment with each other on an arbitrary radius on the plate.

6 . The method of manufacturing the plate according to claim 5 ,
wherein the predetermined widths of the plurality of annular divided regions are equal to each other, and wherein the method of manufacturing the plate according to claim 5 further comprises calculating the numbers of the plurality of circular pores to be formed respectively in the plurality of annular divided regions on the basis of the region radius, the pore diameter, and the target porosity.

7 . The method of manufacturing the plate according to claim 6 , further comprising:
calculating an error between a total area of ones of the plurality of circular pores in one of the plurality of annular divided regions, the total area being calculated on the basis of the number of the ones of the plurality of circular pores, and another total area of the ones of the plurality of circular pores in the one of the plurality of annular divided regions, the other total area being calculated on the basis of the target porosity; and increasing the calculated number of the ones of the plurality of circular pores and reducing the pore diameter in the one of the plurality of annular divided regions if the error is equal to or more than a predetermined value.

8 . The method of manufacturing the plate according to claim 6 ,
wherein the plurality of reference circles in the plurality of annular divided regions are respectively located at centers of the predetermined widths of the plurality of annular divided regions.

9 . The method of manufacturing the plate according to claim 5 ,
wherein the plurality of circular pores are arranged at an equal pitch along a circumferential direction of a corresponding one of the plurality of respective reference circles in the plurality of annular divided regions.

Assignees

• Ebara Corp

Inventors

• Shamoto Mitsuhiro
• Shimoyama Masashi
• Chang Shao Hua

Classifications

• H05K3/188

  by direct electroplating · CPC title

• C25D17/002

  Cell separation, e.g. membranes, diaphragms · CPC title

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D7/12

  Semiconductors · CPC title

• C25D7/00

  Electroplating characterised by the article coated · CPC title