Printed circuit nanofiber web manufacturing method
US-11324123-B2 · May 3, 2022 · US
Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1834 |
| Official title | {Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers} |
| Display label | Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers |
| Total patents | 72 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 7 |
| 2016 | 9 |
| 2017 | 13 |
| 2018 | 8 |
| 2019 | 10 |
| 2020 | 3 |
| 2021 | 9 |
| 2022 | 4 |
| 2023 | 4 |
| 2024 | 3 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electrostatic coating of metal thin layers with adjustable film properties
US-11085114-B2 · Aug 10, 2021 · US
Manufacturing a package using plateable encapsulant
US-11081417-B2 · Aug 3, 2021 · US
Heteroepitaxial structure and method for forming the same, and nanogap electrode
US-2021213707-A1 · Jul 15, 2021 · US
Composition, polymer, and method of producing substrate
US-2021189553-A1 · Jun 24, 2021 · US
Plating method, plating apparatus and recording medium
US-11028483-B2 · Jun 8, 2021 · US
Zincating and doping of metal liner for liner passivation and adhesion improvement
US-2021166971-A1 · Jun 3, 2021 · US
Electroless copper plating and counteracting passivation
US-2021140051-A1 · May 13, 2021 · US
Electroless copper plating and counteracting passivation
US-2021140052-A1 · May 13, 2021 · US
Substrate liquid processing apparatus, substrate liquid processing method and recording medium
US-2021002770-A1 · Jan 7, 2021 · US
Laser surface structuring treatment for plating
US-2020208270-A1 · Jul 2, 2020 · US
Cleaning solution for cleaning metal surfaces
US-2020140782-A1 · May 7, 2020 · US
Printed circuit nanofiber web manufacturing method, printed circuit nanofiber web manufactured thereby, and electronic device employing same
US-2020137891-A1 · Apr 30, 2020 · US
Method for activating metal surfaces to be phosphated
US-10480080-B2 · Nov 19, 2019 · US
Manufacturing a package using plateable encapsulant
US-2019341324-A1 · Nov 7, 2019 · US
Cell trapping filter, cell trapping device, cell trapping method, cell observation method, and cell culturing method
US-2019338234-A1 · Nov 7, 2019 · US
Texturing and plating nickel on aluminum process chamber components
US-2019323127-A1 · Oct 24, 2019 · US
Semiconductor devices comprising nickel— and copper—containing interconnects
US-10446440-B2 · Oct 15, 2019 · US
Semiconductor package with plateable encapsulant and a method for manufacturing the same
US-10396007-B2 · Aug 27, 2019 · US
Plating method, plating apparatus and recording medium
US-2019256980-A1 · Aug 22, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/1834?
- CPC C23C18/1834 is the Cooperative Patent Classification code for “Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers.”
- How many patents are filed under CPC C23C18/1834 (Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers)?
- Our database includes 72 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/1834 growing?
- Publication counts under this code: 3 in 2024 vs 2 in 2025 (latest complete years).