Plating method, plating apparatus and recording medium

Patent metadata

Field	Value
Publication number	US-11028483-B2
Application number	US-201716344932-A
Country	US
Kind code	B2
Filing date	Aug 29, 2017
Priority date	Oct 27, 2016
Publication date	Jun 8, 2021
Grant date	Jun 8, 2021

Abstract

A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is selectively imparted to the plateable material portion 32 by performing a catalyst imparting processing on the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by performing a plating processing on the substrate W. Before the imparting of the catalyst, an organic film 36 is formed on the substrate W by supplying an organic liquid L1 onto the substrate W.

First claim

We claim:

1. A plating method, comprising:
preparing a substrate having, on a surface thereof, a non-plateable material portion to which a catalyst is not substantially adsorbed and a plateable material portion to which the catalyst is adsorbed and made of a different material from the non-plateable material portion, the non-plateable material portion and the plateable material portion being exposed to the surface of the substrate;
imparting a catalyst selectively to the plateable material portion by performing a catalyst imparting processing on the substrate; and
forming a plating layer selectively on the plateable material portion by performing a plating processing on the substrate,
wherein, before the imparting of the catalyst, forming an organic film is performed on the non-plateable material portion and the plateable material portion of the substrate by supplying an organic liquid, which suppresses the catalyst from adhering to the non-plateable material portion, onto the substrate, and
the organic film has a thickness that does not suppress the catalyst from adhering to the plateable material portion.

2. The plating method of claim 1 , further comprising:
removing, after the imparting of the catalyst and before the forming of the plating layer, the organic film by performing a cleaning processing on the substrate.

3. The plating method of claim 1 , further comprising:
heat-treating the substrate after the forming of the organic film and before the imparting of the catalyst.

4. The plating method of claim 1 ,
wherein the substrate includes a base member made of the plateable material portion and a core member which is protruded from the base member and is made of the non-plateable material portion.

5. The plating method of claim 1 ,
wherein the organic liquid contains polyvinylpyrrolidone.

Assignees

• Tokyo Electron Ltd

Inventors

• Inatomi Yuichiro
• Tanaka Takashi
• IWAI Kazutoshi

Classifications

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H10P14/40

  of conductive or resistive materials · CPC title

• C23C18/34 Primary

  using reducing agents · CPC title