Plating method, plating apparatus and recording medium

Patent metadata

Field	Value
Publication number	US-2019256980-A1
Application number	US-201716344932-A
Country	US
Kind code	A1
Filing date	Aug 29, 2017
Priority date	Oct 27, 2016
Publication date	Aug 22, 2019
Grant date	—

Abstract

A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is selectively imparted to the plateable material portion 32 by performing a catalyst imparting processing on the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by performing a plating processing on the substrate W. Before the imparting of the catalyst, an organic film 36 is formed on the substrate W by supplying an organic liquid L 1 onto the substrate W.

First claim

We claim:

1 . A plating method, comprising:
preparing a substrate having a non-plateable material portion and a plateable material portion formed on a surface thereof; imparting a catalyst selectively to the plateable material portion by performing a catalyst imparting processing on the substrate; and forming a plating layer selectively on the plateable material portion by performing a plating processing on the substrate, wherein, before the imparting of the catalyst, forming an organic film is performed on the substrate by supplying an organic liquid onto the substrate.

2 . The plating method of claim 1 , further comprising:
removing, after the imparting of the catalyst and before the forming of the plating layer, the organic film by performing a cleaning processing on the substrate.

3 . The plating method of claim 1 , further comprising:
heat-treating the substrate after the forming of the organic film and before the imparting of the catalyst.

4 . The plating method of claim 1 ,
wherein the substrate includes a base member made of the plateable material portion and a core member which is protruded from the base member and is made of the non-plateable material portion.

5 . The plating method of claim 1 ,
wherein the organic liquid contains polyvinylpyrrolidone.

6 . A plating apparatus, comprising:
a substrate holding unit configured to hold a substrate having a plateable material portion and a non-plateable material portion on a surface thereof; a catalyst imparting unit configured to impart a catalyst selectively to the plateable material portion by performing a catalyst imparting processing on the substrate; a plating liquid supply unit configured to form a plating layer selectively on the plateable material portion by supplying a plating liquid onto the substrate; and an organic liquid supply unit configured to form an organic film on the substrate by supplying an organic liquid onto the substrate.

7 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a plating apparatus to perform a plating method as claimed in claim 1 .

Assignees

• Tokyo Electron Ltd

Inventors

• Inatomi Yuichiro
• Tanaka Takashi
• IWAI Kazutoshi

Classifications

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H10P14/40

  of conductive or resistive materials · CPC title

• C23C18/1865

  Heat · CPC title