Printed circuit nanofiber web manufacturing method, printed circuit nanofiber web manufactured thereby, and electronic device employing same

Patent metadata

Field	Value
Publication number	US-2020137891-A1
Application number	US-201816606192-A
Country	US
Kind code	A1
Filing date	Apr 20, 2018
Priority date	Apr 21, 2017
Publication date	Apr 30, 2020
Grant date	—

Abstract

Provided is a method of manufacturing a printed circuit nano-fiber web. A method of manufacturing a printed circuit nano-fiber web according to an embodiment of the present invention includes (1) a step of electrospinning a spinning solution including a fiber-forming ingredient to manufacture a nano-fiber web; and (2) a step of forming a circuit pattern to coat an outer surface of nano-fiber included in a predetermined region on the nano-fiber web using an electroless plating method. According to the present invention, a circuit pattern-printed nano-fiber web having flexibility and resilience suitable for future smart devices may be realized. In addition, a circuit pattern may be densely formed to a uniform thickness on a flexible nano-fiber web using an electroless plating method, and the flexible nano-fiber web may include a plurality of pores. Accordingly, since the printed circuit nano-fiber web may satisfy waterproofness and air permeability characteristics, it can be used in various future industrial fields including medical devices, such as biopatches, and an electronic device, such as smart devices.

First claim

1 . A method of manufacturing a printed circuit nano-fiber web (1), the method comprising:
(1) a step of electrospinning a spinning solution comprising a fiber-forming ingredient to manufacture a nano-fiber web; and (2) a step of forming a circuit pattern to coat an outer surface of nano-fiber included in a predetermined region on the nano-fiber web using an electroless plating method.

2 . The method according to claim 1 , wherein the nano-fiber web has a thickness of 5 to 200 μm.

3 . The method according to claim 1 , wherein the nano-fiber web has a porosity of 10 to 80%.

4 . The method according to claim 1 , wherein the circuit pattern coated on the nano-fiber has a thickness of 0.1 to 10 μm.

5 . The method according to claim 1 , wherein the nano-fiber web has a thickness of 10 to 150 μm and a porosity of 30 to 60%, and
the circuit pattern coated on the nano-fiber has a thickness of 0.1 to 3 μm.

6 . The method according to claim 1 , wherein the step (2) further comprises:
2-1) a step of immersing the nano-fiber web in a catalyst solution to catalyze the same; 2-2) a step of activating the catalyzed nano-fiber web; and 2-3) a step of forming a circuit pattern on the activated nano-fiber web using an electroless plating method.

7 . The method according to claim 6 , wherein, before the step (2), a step of degreasing or hydrophilizing the nano-fiber web is further comprised.

8 . The method according to claim 6 , wherein the catalyst solution comprises one or more compounds selected from the group consisting of salts of Ti, Sn, Au, Pt, Pd, Ni, Cu, Ag, Al, Zn and Fe.

9 . The method according to claim 6 , wherein the step 2-2) is a step of immersing the catalyzed nano-fiber web in a sulfuric acid solution to activate the same.

10 . The method according to claim 1 , wherein the electroless plating method of the step (2) is a step of masking a surface, except for a portion in which a circuit pattern is to be formed, of the nano-fiber web and immersing in a plating solution.

11 . The method according to claim 10 , wherein the plating solution comprises a metal selected from the group consisting of Ti, Sn, Au, Pt, Pd, Ni, Cu, Ag, Al, Zn, and Fe.

12 . The method according to claim 1 , wherein the circuit pattern of the printed circuit nano-fiber web comprises a first pattern in an upper region and a second pattern in a lower region, and
the first pattern is the same as the second pattern.

13 . The method according to claim 1 , wherein an opposite surface of a circuit pattern-printed surface of the printed circuit nano-fiber web is further provided with a support for strength reinforcement.

14 . The method according to claim 1 , wherein the fiber-forming ingredient comprises one or more compounds selected from the group consisting of polyurethane, polystyrene, polyvinyl alcohol, polymethyl methacrylate, polylactic acid, polyethylene oxide, polyvinyl acetate, polyacrylic acid, polycaprolactone, polyacrylonitrile, polyvinylpyrrolidone, polyvinyl chloride, polycarbonate, polyetherimide, polyethersulfone, polybenzimidazol, polyethylene terephthalate, polybutylene terephthalate, and a fluorine-based compound.

15 . A printed circuit nano-fiber web, comprising:
a nano-fiber web comprising a plurality of nano-fibers; and a circuit pattern formed by coating an outer surface of nano-fiber included in a predetermined region on the nano-fiber web.

16 . An electronic device, comprising:
the printed circuit nano-fiber web according to claim 15 ; and at least one electronic component mounted on the printed circuit nano-fiber web.

Assignees

• Amogreentech Co Ltd

Inventors

• Seo In Yong

Classifications

• H05K3/181 Primary

  by electroless plating (adhesives therefor H05K3/387) · CPC title

• H05K3/12

  using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} · CPC title

• H05K1/18

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K3/108

  by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241) · CPC title