Plating apparatus, plating method and storage medium

Patent metadata

Field	Value
Publication number	US-9487865-B2
Application number	US-201214360984-A
Country	US
Kind code	B2
Filing date	Nov 12, 2012
Priority date	Nov 28, 2011
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

A plating apparatus 20 includes a substrate holding device 110 configured to hold a substrate W; a discharging device 21 configured to discharge a plating liquid 35 toward the substrate W held by the substrate holding device 110 ; and a plating liquid supplying device 30 connected to the discharging device 21 and configured to supply the plating liquid 35 to the discharging device 21 . A gas supplying device 170 is configured to heat a heating gas G having a higher specific heat capacity than air and supply the heated heating gas G toward the substrate W held by the substrate holding device 110 . Further, a controller 160 is configured to control at least the discharging device 21 , the plating liquid supplying device 30 , and the gas supplying device 170.

First claim

We claim:

1. A plating method of performing a plating process by supplying a plating liquid to a substrate, the plating method comprising:
holding the substrate by a substrate holding device; and
plating the substrate by discharging the plating liquid from a discharging device toward the substrate held by the substrate holding device,
wherein, in the plating of the substrate, a heating gas having a higher specific heat capacity than air is heated and supplied toward the substrate held by the substrate holding device, and
wherein, at least one of components contained in the plating liquid exists in a gas phase within a plating liquid supply tank configured to store therein the plating liquid, such that both the plating liquid in a liquid phase and the at least one components in the gas phase are stored in the plating liquid supply tank,
a gas of the at least one of components contained in the plating liquid within the plating liquid supply tank is supplied into the heating gas, and
a mixed gas including the heating gas and the gas of the at least one of components contained in the plating liquid is supplied toward the substrate.

2. The plating method of claim 1 ,
wherein the heating gas is formed of steam.

3. The plating method of claim 1 ,
wherein the heating gas is supplied toward a rear surface of the substrate.

4. The plating method of claim 1 ,
wherein the heating gas is supplied toward a front surface of the substrate.

5. The plating method of claim 1 ,
wherein, in the plating of the substrate, the heating gas is supplied toward the substrate at the substantially same time when the plating liquid is discharged from the discharging device.

6. The plating method of claim 1 ,
wherein, in the plating of the substrate, the heating gas is supplied toward the substrate before the plating liquid is discharged from the discharging device.

7. The plating method of claim 6 ,
wherein, in the plating of the substrate, an inert gas is supplied into the heating gas, and a mixed gas including the heating gas and the inert gas is supplied toward the substrate.

Assignees

• Tokyo Electron Ltd

Inventors

• Inatomi Yuichiro
• Tanaka Takashi
• Iwashita Mitsuaki

Classifications

• C23C18/1651

  Two or more layers only obtained by electroless plating · CPC title

• C23C18/1628

  Specific elements or parts of the apparatus · CPC title

• C23C18/1682

  Control of atmosphere · CPC title

• C23C18/1632

  Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells · CPC title

• C23C18/1678 Primary

  Heating of the substrate · CPC title