Substrate liquid processing apparatus and substrate liquid processing method

Patent metadata

Field	Value
Publication number	US-2021317581-A1
Application number	US-201917264472-A
Country	US
Kind code	A1
Filing date	Jul 18, 2019
Priority date	Jul 31, 2018
Publication date	Oct 14, 2021
Grant date	—

Abstract

A substrate liquid processing apparatus includes a substrate holder 52 configured to attract, hold and rotate a substrate W; a heating device configured to heat the substrate holder 52 from an outside thereof; a plating liquid supply 53 configured to supply a plating liquid L1 onto the substrate W being rotated while being held by the substrate holder 52; and a controller 3 configured to control operations of the substrate holder 52, the heating device and the plating liquid supply 53. The controller 3 controls the heating device to heat the substrate holder 52 to equal to or higher than 50° C. before the substrate W is held by the substrate holder 52.

First claim

1 . A substrate liquid processing apparatus, comprising:
a substrate holder configured to attract, hold and rotate a substrate; a heating device configured to heat the substrate holder from an outside thereof; a plating liquid supply configured to supply a plating liquid onto the substrate being rotated while being held by the substrate holder; and a controller configured to control operations of the substrate holder, the heating device and the plating liquid supply, wherein the controller controls the heating device to heat the substrate holder to equal to or higher than 50° C. before the substrate is held by the substrate holder.

2 . The substrate liquid processing apparatus of claim 1 ,
wherein the heating device is disposed above the substrate holder.

3 . The substrate liquid processing apparatus of claim 2 ,
wherein the heating device is a cover unit equipped with a heater and configured to be placed at a lower position where the cover unit covers the substrate holder or the substrate.

4 . The substrate liquid processing apparatus of claim 1 ,
wherein the heating device is provided under the substrate holder.

5 . The substrate liquid processing apparatus of claim 4 ,
wherein the heating device comprises a heater or a lamp provided at an inner side than an edge of the substrate holder.

6 . The substrate liquid processing apparatus of claim 1 ,
wherein a temperature of the heating device is equal to or lower than 80° C.

7 . A substrate liquid processing method, comprising:
heating a substrate holder, which is configured to attract and hold a substrate, from an outside thereof; holding the substrate by the substrate holder; and performing a plating processing on the substrate by supplying a plating liquid onto the substrate while holding and rotating the substrate horizontally, wherein in the heating of the substrate holder, the substrate holder is heated to equal to or higher than 50° C. before the substrate is held by the substrate holder.

8 . The substrate liquid processing method of claim 7 ,
wherein a heating device in the heating of the substrate holder is disposed at either an upper position above the substrate holder or a lower position under the substrate holder.

9 . The substrate liquid processing method of claim 8 ,
wherein a temperature of the heating device is equal to or lower than 80° C.

Assignees

• Tokyo Electron Ltd

Inventors

• Niwa Takafumi
• Inatomi Yuichiro

Classifications

• H10P72/0431

  Apparatus for thermal treatment · CPC title

• H10W20/01

  Manufacture or treatment · CPC title

• H10P72/0476

  comprising at least one plating chamber · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title