Metal wiring layer forming method, metal wiring layer forming apparatus and recording medium
US-10755973-B2 · Aug 25, 2020 · US
Specific elements or parts of the apparatus
Specific elements or parts of the apparatus · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1628 |
| Official title | {Specific elements or parts of the apparatus} |
| Display label | Specific elements or parts of the apparatus |
| Total patents | 117 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 15 |
| 2017 | 15 |
| 2018 | 9 |
| 2019 | 10 |
| 2020 | 9 |
| 2021 | 13 |
| 2022 | 15 |
| 2023 | 10 |
| 2024 | 5 |
| 2025 | 9 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Surface treating apparatus and surface treatment method
US-2020224314-A1 · Jul 16, 2020 · US
Surface treating apparatus
US-2020080204-A1 · Mar 12, 2020 · US
Surface treating apparatus
US-10576492-B2 · Mar 3, 2020 · US
Plating apparatus
US-10577706-B2 · Mar 3, 2020 · US
Surface treating apparatus
US-10513779-B2 · Dec 24, 2019 · US
Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device
US-2019360105-A1 · Nov 28, 2019 · US
Surface treatment device, surface treatment method and paddle
US-2019309435-A1 · Oct 10, 2019 · US
Electrolytic plating apparatus
US-2019295836-A1 · Sep 26, 2019 · US
Stream flow sparger for electroless nickel plating
US-10422039-B2 · Sep 24, 2019 · US
Electroless Plating Activation
US-2019274224-A1 · Sep 5, 2019 · US
Plating method, plating apparatus and recording medium
US-2019267242-A1 · Aug 29, 2019 · US
Plating apparatus
US-2019233964-A1 · Aug 1, 2019 · US
Metal wiring layer forming method, metal wiring layer forming apparatus and recording medium
US-2019229016-A1 · Jul 25, 2019 · US
Plating apparatus
US-10294576-B2 · May 21, 2019 · US
Manufacturing method of rotating machine, plating method of rotating machine, and rotating machine
US-10113237-B2 · Oct 30, 2018 · US
Metallization of the wafer edge for optimized electroplating performance on resistive substrates
US-10079207-B2 · Sep 18, 2018 · US
Plating apparatus
US-10077504-B2 · Sep 18, 2018 · US
Method and apparatus for manufacturing lead wire for solar cell
US-2018240930-A1 · Aug 23, 2018 · US
Method and apparatus for manufacturing lead wire for solar cell
US-9991410-B2 · Jun 5, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/1628?
- CPC C23C18/1628 is the Cooperative Patent Classification code for “Specific elements or parts of the apparatus.”
- How many patents are filed under CPC C23C18/1628 (Specific elements or parts of the apparatus)?
- Our database includes 117 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/1628 growing?
- Publication counts under this code: 5 in 2024 vs 9 in 2025 (latest complete years).