Substrate processing apparatus and substrate processing method
US-12404587-B2 · Sep 2, 2025 · US
Heating of the substrate
Heating of the substrate · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1678 |
| Official title | {Heating of the substrate} |
| Display label | Heating of the substrate |
| Total patents | 38 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 5 |
| 2017 | 2 |
| 2018 | 5 |
| 2020 | 5 |
| 2021 | 1 |
| 2022 | 6 |
| 2023 | 1 |
| 2024 | 2 |
| 2025 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate processing method
US-12378670-B2 · Aug 5, 2025 · US
Substrate processing apparatus and substrate processing method
US-12276027-B2 · Apr 15, 2025 · US
System and method for performing localized electroless nickel plating
US-2025051926-A1 · Feb 13, 2025 · US
Substrate liquid processing apparatus and substrate liquid processing method
US-12209314-B2 · Jan 28, 2025 · US
Substrate processing method
US-2024141501-A1 · May 2, 2024 · US
Substrate processing apparatus, substrate processing method and recording medium
US-11905597-B2 · Feb 20, 2024 · US
Substrate processing apparatus and substrate processing method
US-2023098105-A1 · Mar 30, 2023 · US
Substrate liquid processing apparatus and substrate liquid processing method
US-2022396882-A1 · Dec 15, 2022 · US
Plating method and recording medium
US-11519074-B2 · Dec 6, 2022 · US
Substrate processing method and substrate processing apparatus
US-2022251709-A1 · Aug 11, 2022 · US
Substrate processing apparatus and substrate processing method
US-2022154342-A1 · May 19, 2022 · US
Substrate processing apparatus, substrate processing method and recording medium
US-2022145468-A1 · May 12, 2022 · US
Substrate processing apparatus and substrate processing method
US-2022056590-A1 · Feb 24, 2022 · US
Substrate liquid processing apparatus and substrate liquid processing method
US-2021317581-A1 · Oct 14, 2021 · US
Multilayer wiring forming method and recording medium
US-2020395243-A1 · Dec 17, 2020 · US
Plating method and recording medium
US-2020325581-A1 · Oct 15, 2020 · US
Plating apparatus, plating method, and recording medium
US-10731256-B2 · Aug 4, 2020 · US
Composite plating film
US-10570518-B2 · Feb 25, 2020 · US
Coated glass sleeves and methods of coating glass sleeves
US-2020024184-A1 · Jan 23, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/1678?
- CPC C23C18/1678 is the Cooperative Patent Classification code for “Heating of the substrate.”
- How many patents are filed under CPC C23C18/1678 (Heating of the substrate)?
- Our database includes 38 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/1678 growing?
- Publication counts under this code: 2 in 2024 vs 5 in 2025 (latest complete years).