Multilayer wiring forming method and recording medium

Patent metadata

Field	Value
Publication number	US-2020395243-A1
Application number	US-201916971450-A
Country	US
Kind code	A1
Filing date	Feb 7, 2019
Priority date	Feb 21, 2018
Publication date	Dec 17, 2020
Grant date	—

Abstract

A multilayer wiring forming method includes filling a via, which is formed in an insulating film including an oxide film formed on a wiring of a substrate and is extended to the wiring, by forming an electroless plating film, which does not diffuse into the oxide film, from a bottom surface of the via while using the wiring, which is exposed at the bottom surface of the via, as a catalyst.

First claim

1 . A multilayer wiring forming method, comprising:
filling a via, which is formed in an insulating film including an oxide film formed on a wiring of a substrate and is extended to the wiring, by forming an electroless plating film, which does not diffuse into the oxide film, from a bottom surface of the via while using the wiring, which is exposed at the bottom surface of the via, as a catalyst.

2 . The multilayer wiring forming method of claim 1 ,
wherein the wiring contains Co, Ni or Ru.

3 . A multilayer wiring forming method, comprising:
filling a via, which is formed in an insulating film including an oxide film formed on a wiring of a substrate and is extended to the wiring, by forming an electroless plating film, which does not diffuse into the oxide film, from a bottom surface of the via while using a barrier film, which is exposed at the bottom surface of the via, as a catalyst.

4 . The multilayer wiring forming method of claim 3 ,
wherein the wiring contains Cu.

5 . The multilayer wiring forming method of claim 1 ,
wherein the electroless plating film contains Co and W.

6 . The multilayer wiring forming method of claim 5 ,
wherein the electroless plating film contains 1 at % to 20 at % of W, and a rest of the electroless plating film is made of Co and an inevitable impurity.

7 . The multilayer wiring forming method of claim 1 ,
wherein the electroless plating film contains Ni.

8 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a multilayer wiring forming system to perform a multilayer wiring forming method as claimed in claim 1 .

Assignees

• Tokyo Electron Ltd

Inventors

• Iwashita Mitsuaki

Classifications

• H10P14/60

  of insulating materials · CPC title

• H10P14/46 Primary

  using a liquid · CPC title

• H10W20/48

  Insulating materials thereof · CPC title

• H10W20/044

  for electroless plating · CPC title

• H10W20/4437

  the principal metal being a transition metal · CPC title