Composite plating film

Patent metadata

Field	Value
Publication number	US-10570518-B2
Application number	US-201715667992-A
Country	US
Kind code	B2
Filing date	Aug 3, 2017
Priority date	Aug 3, 2016
Publication date	Feb 25, 2020
Grant date	Feb 25, 2020

Abstract

An object is to provide a composite plating film excellent in the water-repellent property and oil-repellent property using a material that is less likely to accumulate in the environment, as substitute for a fluorine resin. A composite plating film is provided which includes an alloy matrix phase and a silicone dispersed in the alloy matrix phase. In the composite plating film, the silicone preferably has Hansen solubility parameters comprising a dispersion term δ D of 15 MPa 1/2 or less, a polar term δ P of 3 MPa 1/2 or less, and a hydrogen bonding term δ H of 3 MPa 1/2 or less. The silicone preferably has an interaction radius of a Hansen solubility sphere of 5.0 MPa 1/2 or less.

First claim

The invention claimed is:

1. A composite plating film comprising:
an alloy matrix phase; and
a silicone dispersed in the alloy matrix phase, the silicone being selected from the group consisting of octamethylsilsesquioxane, hexamethyldisiloxane, octamethyltrisloxane, decamethyltetrasiloxane, and hexamethylcyclotrisiloxane,
wherein the silicone has Hansen solubility parameters comprising a dispersion term δ D of 15 MPa 1/2 or less, a polar term δ P of 3 MPa 1/2 or less, and a hydrogen bonding term δ H of 3 MPa 1/2 or less.

2. The composite plating film as recited in claim 1 , wherein the silicone has a siloxane skeleton of which a side chain group is an alkyl group.

3. The composite plating film as recited in claim 1 , wherein the silicone has an interaction radius of a Hansen solubility sphere of 5.0 MPa 1/2 or less.

4. The composite plating film as recited in claim 1 , wherein the silicone comprises particles having a particle size of 20 micrometers or less.

5. The composite plating film as recited in claim 1 , wherein the silicone is octamethylsilsesquioxane.

6. The composite plating film as recited in claim 1 , wherein the silicone contained in the composite plating film has a content ratio of 3.5 mass % or more to the composite plating film as a whole as a mass percentage of Si atoms that constitute the silicone.

7. The composite plating film as recited in claim 1 , wherein a static contact angle of water on the composite plating film is 100 degrees or more.

8. The composite plating film as recited in claim 1 , wherein a static contact angle of an organic solvent on the composite plating film is 90 degrees or more, wherein the organic solvent has a surface tension of 45 mN/m or more.

9. The composite plating film as recited in claim 1 , wherein the alloy matrix phase comprises one or more metals selected from Ni, Cu, and Co.

10. The composite plating film as recited in claim 9 , wherein the alloy matrix phase is a Ni—P alloy matrix phase.

11. The composite plating film as recited in claim 10 , wherein a concentration of phosphorus in the Ni—P alloy matrix phase is 5 mass % or more and 11 mass % or less to the Ni—P alloy matrix phase as a whole.

Assignees

• Toyota Chuo Kenkyusho Kk

Inventors

• Murase Masakazu
• Ohta Riichiro
• Dong Shuxin

Classifications

• B32B15/015

  the said other metal being copper or nickel or an alloy thereof · CPC title

• C23C18/1662

  Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires · CPC title

• C22C19/00

  Alloys based on nickel or cobalt · CPC title

• C22C45/04

  with nickel or cobalt as the major constituent · CPC title

• C22C19/03

  based on nickel · CPC title