Semiconductor device and semiconductor device manufacturing method
US-2016351442-A1 · Dec 1, 2016 · US
Two or more layers only obtained by electroless plating
Two or more layers only obtained by electroless plating · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1651 |
| Official title | {Two or more layers only obtained by electroless plating} |
| Display label | Two or more layers only obtained by electroless plating |
| Total patents | 424 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 47 |
| 2016 | 71 |
| 2017 | 42 |
| 2018 | 45 |
| 2019 | 45 |
| 2020 | 47 |
| 2021 | 32 |
| 2022 | 33 |
| 2023 | 17 |
| 2024 | 20 |
| 2025 | 22 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for metalizing polymer substrate and polymer article prepared thereof
US-2016326652-A1 · Nov 10, 2016 · US
Uv curable catalyst compositions
US-2016319434-A9 · Nov 3, 2016 · US
Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure
US-9478326-B2 · Oct 25, 2016 · US
Conductive nanowire films
US-2016268013-A1 · Sep 15, 2016 · US
Wiring pattern manufacturing method and transistor manufacturing method
US-2016260916-A1 · Sep 8, 2016 · US
High resistivity soft magnetic material for miniaturized power converter
US-9437668-B1 · Sep 6, 2016 · US
Abutment for a tubular component overlaid with a metallic composite deposit and method for making it
US-2016244883-A1 · Aug 25, 2016 · US
Method for producing a semiconductor element of a direct-converting x-ray detector
US-9419169-B2 · Aug 16, 2016 · US
Method forming through-via using electroless plating solution
US-9401307-B2 · Jul 26, 2016 · US
Plated polymer aviation components
US-2016167791-A1 · Jun 16, 2016 · US
Surface metallizing method, method for preparing plastic article and plastic article made therefrom
US-2016068963-A1 · Mar 10, 2016 · US
Secondary battery
US-9269942-B2 · Feb 23, 2016 · US
Electroless surface treatment plated layers of printed circuit board and method for preparing the same
US-2015382452-A1 · Dec 31, 2015 · US
Electrochemical Fabrication Process for Forming Multilayer Multimaterial Microprobe Structures
US-2015368820-A9 · Dec 24, 2015 · US
Methods for depositing metal on a reactive metal film
US-2015348836-A1 · Dec 3, 2015 · US
Deposition of a protective coating including metal-containing and chromium-containing layers on zirconium alloy for nuclear power applications
US-2015348652-A1 · Dec 3, 2015 · US
Separator for fuel cells, fuel cell, fuel cell stack, and method of manufacturing separator for fuel cells
US-2015340714-A1 · Nov 26, 2015 · US
Coating and electronic component
US-9177687-B2 · Nov 3, 2015 · US
Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes
US-2015287898-A1 · Oct 8, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/1651?
- CPC C23C18/1651 is the Cooperative Patent Classification code for “Two or more layers only obtained by electroless plating.”
- How many patents are filed under CPC C23C18/1651 (Two or more layers only obtained by electroless plating)?
- Our database includes 424 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/1651 growing?
- Publication counts under this code: 20 in 2024 vs 22 in 2025 (latest complete years).