Bonding apparatus and bonding system
US-2018047699-A1 · Feb 15, 2018 · US
Substrate bonding device, calculation device, substrate bonding method, and calculation method
US12598939B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12598939-B2 |
| Application number | US-202117235780-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 20, 2021 |
| Priority date | Oct 25, 2018 |
| Publication date | Apr 7, 2026 |
| Grant date | Apr 7, 2026 |
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Abstract
Official abstract text for this publication.
Provided is a substrate bonding apparatus comprising: a first holding unit for holding a first substrate; and a second holding unit for holding a second substrate, wherein the substrate bonding apparatus is configured to bond the first substrate and the second substrate by, after forming a contact region between a part of the first substrate and a part of the second substrate, expanding the contact region to form an initially bonded region and releasing the second substrate having the initially bonded region formed thereon from the second holding unit.
First claim
Opening claim text (preview).
What is claimed is: 1 . A substrate bonding apparatus comprising: a first holder configured to hold a first substrate; and a second holder configured to hold a second substrate, wherein the substrate bonding apparatus is configured to bond the first substrate and the second substrate by; forming a contact region between a part of the first substrate and a part of the second substrate; after forming the contact region, expanding the contact region so as to form an initiall…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10P72/78Primary
Electricity · mapped topic
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- What does patent US12598939B2 cover?
- Provided is a substrate bonding apparatus comprising: a first holding unit for holding a first substrate; and a second holding unit for holding a second substrate, wherein the substrate bonding apparatus is configured to bond the first substrate and the second substrate by, after forming a contact region between a part of the first substrate and a part of the second substrate, expanding the con…
- Who is the assignee on this patent?
- Screen Holdings Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P72/78. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 07 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).