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Bonding apparatus
US2018019140A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018019140-A1 |
| Application number | US-201715644928-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 10, 2017 |
| Priority date | Jul 12, 2016 |
| Publication date | Jan 18, 2018 |
| Grant date | — |
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Abstract
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A bonding apparatus includes an upper holding unit, a lower holding unit, a pushing unit and an attracting/holding unit. The upper holding unit is configured to hold a first substrate from a top surface thereof which is a non-bonding surface. The lower holding unit is provided under the upper holding unit and is configured to hold a second substrate from a bottom surface thereof while allowing the second substrate to face the first substrate. The pushing unit is configured to press a central portion of the first substrate from above to bring the central portion of the first substrate into contact with the second substrate. The attracting/holding unit is configured to be moved up and down with respect to the upper holding unit and hold a part of the top surface of the first substrate by attraction before the first substrate is held by the upper holding unit.
First claim
Opening claim text (preview).
We claim: 1 . A bonding apparatus, comprising: an upper holding unit configured to hold a first substrate from a top surface thereof which is a non-bonding surface; a lower holding unit provided under the upper holding unit and configured to hold a second substrate from a bottom surface thereof while allowing the second substrate to face the first substrate; a pushing unit configured to press a central portion of the first substrate from above to bring the central portion of…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US2018019140A1 cover?
- A bonding apparatus includes an upper holding unit, a lower holding unit, a pushing unit and an attracting/holding unit. The upper holding unit is configured to hold a first substrate from a top surface thereof which is a non-bonding surface. The lower holding unit is provided under the upper holding unit and is configured to hold a second substrate from a bottom surface thereof while allowing …
- Who is the assignee on this patent?
- Tokyo Electron Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jan 18 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).