Substrate holder and method for bonding two substrates

US2018040495A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018040495-A1
Application numberUS-201515551733-A
CountryUS
Kind codeA1
Filing dateApr 10, 2015
Priority dateApr 10, 2015
Publication dateFeb 8, 2018
Grant date

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  2. Abstract

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  5. First independent claim

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Abstract

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A substrate holder having a fixing surface for holding a substrate, a system having such a substrate holder, a use of such a substrate holder, a method for bonding two substrates and a product, particularly a substrate stack, produced using such a method and also a use of such a substrate holder for such a method.

First claim

Opening claim text (preview).

1 - 19 . (canceled) 20 . A substrate holder comprising: a fixing surface for holding a substrate; a heat-conducting body for dissipating heat away from the fixing surface, wherein the heat is dissipated to a rear side of the substrate holder; and a heat exchanger arranged at the rear side of the substrate holder for dissipating the heat. 21 . The substrate holder according to claim 20 , wherein the heat-conducting body includes ribs for dissipa…

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What does patent US2018040495A1 cover?
A substrate holder having a fixing surface for holding a substrate, a system having such a substrate holder, a use of such a substrate holder, a method for bonding two substrates and a product, particularly a substrate stack, produced using such a method and also a use of such a substrate holder for such a method.
Who is the assignee on this patent?
Ev Group E Thallner Gmbh
What technology area does this patent fall under?
Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Feb 08 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).