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Substrate bonding method and substrate bonding apparatus
US2015140689A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015140689-A1 |
| Application number | US-201414198339-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 5, 2014 |
| Priority date | Nov 18, 2013 |
| Publication date | May 21, 2015 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
According to one embodiment, there is provided a substrate bonding method. The substrate bonding method includes disposing a first substrate and a second substrate to face each other. The substrate bonding method includes controlling the first substrate and the second substrate to have a temperature difference. The substrate bonding method includes, in a state where the first substrate and the second substrate are controlled to have the temperature difference, bonding the first substrate to the second substrate by bringing the first substrate into contact with the second substrate while deforming the first substrate so that a central portion of the first substrate is projected toward the second substrate. The central portion of the first substrate is on an inner side of a peripheral portion of the first substrate.
First claim
Opening claim text (preview).
What is claimed is: 1 . A substrate bonding method comprising: disposing a first substrate and a second substrate to face each other; controlling the first substrate and the second substrate to have a temperature difference; and in a state where the first substrate and the second substrate are controlled to have the temperature difference, bonding the first substrate to the second substrate by bringing the first substrate into contact with the second substrate while deformin…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10P72/0428Primary
Electricity · mapped topic
- H10P74/238Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2015140689A1 cover?
- According to one embodiment, there is provided a substrate bonding method. The substrate bonding method includes disposing a first substrate and a second substrate to face each other. The substrate bonding method includes controlling the first substrate and the second substrate to have a temperature difference. The substrate bonding method includes, in a state where the first substrate and the …
- Who is the assignee on this patent?
- Toshiba Kk
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu May 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).