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Bonding device and bonding system
US2015129137A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015129137-A1 |
| Application number | US-201414532294-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 4, 2014 |
| Priority date | Nov 13, 2013 |
| Publication date | May 14, 2015 |
| Grant date | — |
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- Title
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Abstract
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Provided is a device of bonding substrates together, which includes a first holding unit configured to vacuum-draw a first substrate and to adsorptively hold the first substrate on a lower surface thereof and a second holding unit installed below the first holding unit and configured to vacuum-draw a second substrate and to adsorptively hold the second substrate on an upper surface thereof. The second holding unit includes: a body portion configured to vacuum-draw the entire surface of the second substrate; a plurality of pins installed on the body portion and configured to make contact with a rear surface of the second substrate; and a support portion installed on the body portion at the outer side of the pins, the support portion having a reduced contact area over which the support portion makes contact with an outer peripheral portion of the second substrate.
First claim
Opening claim text (preview).
What is claimed is: 1 . A device of bonding substrates together, comprising: a first holding unit configured to vacuum-draw a first substrate and to adsorptively hold the first substrate on a lower surface thereof; and a second holding unit installed below the first holding unit and configured to vacuum-draw a second substrate and to adsorptively hold the second substrate on an upper surface thereof, wherein the second holding unit includes: a body portion configured to va…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US2015129137A1 cover?
- Provided is a device of bonding substrates together, which includes a first holding unit configured to vacuum-draw a first substrate and to adsorptively hold the first substrate on a lower surface thereof and a second holding unit installed below the first holding unit and configured to vacuum-draw a second substrate and to adsorptively hold the second substrate on an upper surface thereof. The…
- Who is the assignee on this patent?
- Tokyo Electron Ltd
- What technology area does this patent fall under?
- Primary CPC classification B32B38/1858. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu May 14 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).