Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/0616 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 2,770 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 81 |
| 2016 | 80 |
| 2017 | 122 |
| 2018 | 187 |
| 2019 | 271 |
| 2020 | 328 |
| 2021 | 292 |
| 2022 | 315 |
| 2023 | 322 |
| 2024 | 320 |
| 2025 | 364 |
| 2026 | 88 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Diagnostic device, semiconductor manufacturing equipment system, semiconductor equipment manufacturing system, and diagnostic method
US-2024321608-A1 · Sep 26, 2024 · US
Transfer device
US-2024253899-A1 · Aug 1, 2024 · US
Bonding method and bonding apparatus
US-11931995-B2 · Mar 19, 2024 · US
Substrate treating apparatus and substrate treating method
US-2024030057-A1 · Jan 25, 2024 · US
Substrate imaging apparatus
US-2024022693-A1 · Jan 18, 2024 · US
Linear inspection system
US-2015377796-A1 · Dec 31, 2015 · US
Semiconductor manufacturing apparatus and device manufacturing method using substrate distortion correction
US-9209052-B2 · Dec 8, 2015 · US
Substrate transport apparatus
US-2015340258-A1 · Nov 26, 2015 · US
Substrate cleaning apparatus and method executed in the same
US-2015338328-A1 · Nov 26, 2015 · US
Processing systems and methods for halide scavenging
US-2015332930-A1 · Nov 19, 2015 · US
Semiconductor inspection device, and inspection method using charged particle beam
US-2015303030-A1 · Oct 22, 2015 · US
Processing systems and methods for halide scavenging
US-9153442-B2 · Oct 6, 2015 · US
Curvature measurement apparatus and method
US-2015276388-A1 · Oct 1, 2015 · US
Thin film deposition apparatus and method of forming thin film using the same
US-2015275347-A1 · Oct 1, 2015 · US
Method of manufacturing pressure sensor, deposition system, and annealing system
US-2015268116-A1 · Sep 24, 2015 · US
Warp correction device and warp correction method for semiconductor element substrate
US-9136192-B2 · Sep 15, 2015 · US
Method and system for a semiconductor for device package with a die-to-packaging substrate first bond
US-9136159-B2 · Sep 15, 2015 · US
Substrate processing apparatus, substrate processing method and non-transitory storage medium
US-9136150-B2 · Sep 15, 2015 · US
Substrate processing apparatus, substrate processing method and memory medium
US-2015255355-A1 · Sep 10, 2015 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/0616?
- CPC H10P72/0616 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10P72/0616 (Electricity)?
- Our database includes 2,770 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/0616 growing?
- Publication counts under this code: 320 in 2024 vs 364 in 2025 (latest complete years).