Device and method for bonding substrates
US-2015210057-A1 · Jul 30, 2015 · US
Apparatus for stacking substrates and method for the same
US2017278803A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017278803-A1 |
| Application number | US-201715618615-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 9, 2017 |
| Priority date | Dec 10, 2014 |
| Publication date | Sep 28, 2017 |
| Grant date | — |
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Abstract
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A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.
First claim
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What is claimed is: 1 . A substrate stacking apparatus that stacks a first substrate and a second substrate on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first substrate and the second substrate, and then expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section,…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US2017278803A1 cover?
- A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrat…
- Who is the assignee on this patent?
- Nikon Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W46/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Sep 28 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).