Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
Systems and methods for molecular bonding of substrates
US2015056783A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015056783-A1 |
| Application number | US-201414334328-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 3, 2014 |
| Priority date | Oct 12, 2010 |
| Publication date | Feb 26, 2015 |
| Grant date | — |
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Abstract
Official abstract text for this publication.
A method for bonding a first substrate having a first surface to a second substrate having a second surface. This method includes the steps of holding the first substrate by at least two support points, positioning the first substrate and the second substrate so that the first surface and the second surface face each other, deforming the first substrate by applying between at least one pressure point and the two support points a strain toward the second substrate, bringing the deformed first surface and the second surface into contact, and progressively releasing the strain to facilitate bonding of the substrates while minimizing or avoiding the trapping of air bubbles between the substrates.
First claim
Opening claim text (preview).
What is claimed is: 1 . A bonding system for bonding a first substrate to a second substrate, comprising: at least two support elements located and configured to support a first substrate thereon such that the first substrate is unsupported between the at least two support elements; a support device configured to support a second substrate in alignment with the first substrate when the first substrate is supported by the at least two support elements; and at least one strain…
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10P10/128Primary
Electricity · mapped topic
- H10P72/0442Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2015056783A1 cover?
- A method for bonding a first substrate having a first surface to a second substrate having a second surface. This method includes the steps of holding the first substrate by at least two support points, positioning the first substrate and the second substrate so that the first surface and the second surface face each other, deforming the first substrate by applying between at least one pressure…
- Who is the assignee on this patent?
- Soitec Silicon On Insulator
- What technology area does this patent fall under?
- Primary CPC classification H10P10/128. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Feb 26 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).