Apparatus and method for bonding substrates
US-9613840-B2 · Apr 4, 2017 · US
Method and device for embossing of a nanostructure
US2017001431A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017001431-A1 |
| Application number | US-201415113111-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 22, 2014 |
| Priority date | Apr 22, 2014 |
| Publication date | Jan 5, 2017 |
| Grant date | — |
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Abstract
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A method for embossing a nanostructure, formed on a nanostructure punch, into a punch surface of a curable material which has been applied to a substrate. The method includes the following steps, especially following sequence: alignment of the nanostructure relative to the punch surface, embossing of the punch surface by a) prestressing of the nanostructure punch by deformation of the nanostructure punch and/or prestressing of the substrate by deformation of the substrate, b) making contact of a partial area of the punch surface with the nanostructure punch and c) automatic contacting of the remaining surface at least partially, especially predominantly, by the prestressing of the nanostructure punch and/or the prestressing of the substrate.
First claim
Opening claim text (preview).
1 - 8 . (canceled) 9 . A method for embossing a nanostructure that is formed on a nanostructure punch into a punch surface of a curable material which has been applied to a substrate, the method comprising: aligning the nanostructure relative to the punch surface, embossing the punch surface with the nanostructure by A) prestressing the nanostructure punch by deforming the nanostructure punch, B) contacting a partial area of the punch surface with the nanostructure p…
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Classifications
Electricity · mapped topic
- B41F19/02Primary
Operations & Transport · mapped topic
Physics · mapped topic
- G03F7/0002Primary
Physics · mapped topic
Physics · mapped topic
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Frequently asked questions
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- What does patent US2017001431A1 cover?
- A method for embossing a nanostructure, formed on a nanostructure punch, into a punch surface of a curable material which has been applied to a substrate. The method includes the following steps, especially following sequence: alignment of the nanostructure relative to the punch surface, embossing of the punch surface by a) prestressing of the nanostructure punch by deformation of the nanostruc…
- Who is the assignee on this patent?
- Ev Group E Thallner Gmbh
- What technology area does this patent fall under?
- Primary CPC classification B41F19/02. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Jan 05 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).