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US-2024268119-A1 · Aug 8, 2024 · US
Bonding apparatus and bonding system
US2018047699A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018047699-A1 |
| Application number | US-201715670072-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 7, 2017 |
| Priority date | Aug 9, 2016 |
| Publication date | Feb 15, 2018 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
Deformation of substrates after the substrates are bonded can be suppressed. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit provided under the first holding unit and configured to attract and hold a second substrate from below; and a striker configured to press a central portion of the first substrate from above and bring the first substrate into contact with the second substrate. The first holding unit is configured to attract and hold a partial region of a peripheral portion of the first substrate, and the first holding unit attracts and holds the region which intersects with a direction, among directions from the central portion of the first substrate toward the peripheral portion thereof, in which a bonding region between the first substrate and the second substrate is expanded fastest.
First claim
Opening claim text (preview).
We claim: 1 . A bonding apparatus, comprising: a first holding unit configured to attract and hold a first substrate from above; a second holding unit provided under the first holding unit and configured to attract and hold a second substrate from below; and a striker configured to press a central portion of the first substrate from above and bring the first substrate into contact with the second substrate, wherein the first holding unit is configured to attract and hold a…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H10P90/1914Primary
Electricity · mapped topic
- H10P72/0428Primary
Electricity · mapped topic
- H10W72/0113Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2018047699A1 cover?
- Deformation of substrates after the substrates are bonded can be suppressed. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit provided under the first holding unit and configured to attract and hold a second substrate from below; and a striker configured to press a central portion of the first substrate from abo…
- Who is the assignee on this patent?
- Tokyo Electron Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P90/1914. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Feb 15 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).