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Alignment Systems and Wafer Bonding Systems and Methods
US2015044786A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015044786-A1 |
| Application number | US-201313963741-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 9, 2013 |
| Priority date | Aug 9, 2013 |
| Publication date | Feb 12, 2015 |
| Grant date | — |
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Abstract
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Alignment systems, and wafer bonding alignment systems and methods are disclosed. In some embodiments, an alignment system for a wafer bonding system includes means for monitoring an alignment of a first wafer and a second wafer, and means for adjusting a position of the second wafer. The alignment system includes means for feeding back a relative position of the first wafer and the second wafer to the means for adjusting the position of the second wafer before and during a bonding process for the first wafer and the second wafer.
First claim
Opening claim text (preview).
What is claimed is: 1 . An alignment system for a wafer bonding system, the alignment system comprising: means for monitoring an alignment of a first wafer and a second wafer; means for adjusting a position of the second wafer; and means for feeding back a relative position of the first wafer and the second wafer to the means for adjusting the position of the second wafer before and during a bonding process for the first wafer and the second wafer. 2…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US2015044786A1 cover?
- Alignment systems, and wafer bonding alignment systems and methods are disclosed. In some embodiments, an alignment system for a wafer bonding system includes means for monitoring an alignment of a first wafer and a second wafer, and means for adjusting a position of the second wafer. The alignment system includes means for feeding back a relative position of the first wafer and the second wafe…
- Who is the assignee on this patent?
- Taiwan Semiconductor Mfg
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Feb 12 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).