Chip package and method of forming a chip package
US-2024371796-A1 · Nov 7, 2024 · US
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Rogalli Michael patents
Rogalli Michael is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Rogalli Michael |
| Total patents | 17 |
| First publication | Jun 25, 2015 |
| Latest publication | Nov 7, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Chip package and method of forming a chip package
US-12040288-B2 · Jul 16, 2024 · US
Chip package and method of forming a chip package
US-2023395532-A1 · Dec 7, 2023 · US
Chip package and method of forming a chip package
US-11735534-B2 · Aug 22, 2023 · US
Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device
US-11424201-B2 · Aug 23, 2022 · US
Chip package and method of forming a chip package
US-2021375792-A1 · Dec 2, 2021 · US
Adhesion Enhancing Structures for a Package
US-2020043876-A1 · Feb 6, 2020 · US
Semiconductor device having a copper element and method of forming a semiconductor device having a copper element
US-10446469-B2 · Oct 15, 2019 · US
Method of Forming an Aluminum Oxide Layer, Metal Surface with Aluminum Oxide Layer, and Electronic Device
US-2018366427-A1 · Dec 20, 2018 · US
Semiconductor devices and processing methods
US-10103123-B2 · Oct 16, 2018 · US
Recent patents
Latest publications not already listed above.
Semiconductor devices and processing methods
US-2017236801-A1 · Aug 17, 2017 · US
Semiconductor Device Having a Copper Element and Method of Forming a Semiconductor Device Having a Copper Element
US-2016329263-A1 · Nov 10, 2016 · US
Integrated circuit and method of forming an integrated circuit
US-9418937-B2 · Aug 16, 2016 · US
Method for providing a self-aligned pad protection in a semiconductor device
US-9385031-B2 · Jul 5, 2016 · US
Method for providing a self-aligned pad protection in a semiconductor device
US-2015357234-A1 · Dec 10, 2015 · US
Method for providing a self-aligned pad protection in a semiconductor device
US-9165821-B2 · Oct 20, 2015 · US
Methods for processing a semiconductor device
US-2015179507-A1 · Jun 25, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 17 |
| Detzel Thomas | 1 |
| Gross Johann | 1 |
| Illing Robert | 1 |
| Krug Maximilian | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/923 | 14 |
| H10W72/019 | 14 |
| H01L24/03 | 10 |
| H01L24/05 | 10 |
| H10W72/952 | 9 |