Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/019 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 8,660 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 639 |
| 2016 | 623 |
| 2017 | 744 |
| 2018 | 681 |
| 2019 | 687 |
| 2020 | 873 |
| 2021 | 892 |
| 2022 | 834 |
| 2023 | 852 |
| 2024 | 889 |
| 2025 | 790 |
| 2026 | 156 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Memory devices having signal routing structures at bonding interfaces
US-2024404976-A1 · Dec 5, 2024 · US
Semiconductor device manufacturing method and semiconductor device manufactured using the same
US-2024395745-A1 · Nov 28, 2024 · US
Device structure and methods of forming the same
US-2024371920-A1 · Nov 7, 2024 · US
Method for fabricating three-dimensional semiconductor device using buried stop layer in substrate
US-2024268119-A1 · Aug 8, 2024 · US
Conductive barrier direct hybrid bonding
US-2024243085-A1 · Jul 18, 2024 · US
Semiconductor packages and methods for fabricating the same
US-2024203855-A1 · Jun 20, 2024 · US
Chip package structure and method for preparing chip package structure
US-2024178167-A1 · May 30, 2024 · US
Apparatus for non-volatile random access memory stacks
US-2024145438-A1 · May 2, 2024 · US
Semiconductor package
US-2024105657-A1 · Mar 28, 2024 · US
Methods for forming metal gapfill with low resistivity
US-2024088071-A1 · Mar 14, 2024 · US
Wafer-level package including under bump metal layer
US-11862589-B2 · Jan 2, 2024 · US
Multiple bond via arrays of different wire heights on a same substrate
US-2015380377-A1 · Dec 31, 2015 · US
Semiconductor device including passivation layer encapsulant
US-9214385-B2 · Dec 15, 2015 · US
Method of making a die with recessed aluminum die pads
US-9209078-B2 · Dec 8, 2015 · US
Electronic device packages having bumps and methods of manufacturing the same
US-9209146-B2 · Dec 8, 2015 · US
Pass-through 3D interconnect for microelectronic dies and associated systems and methods
US-9209158-B2 · Dec 8, 2015 · US
Substrate including selectively formed barrier layer
US-2015348831-A1 · Dec 3, 2015 · US
Semiconductor device
US-2015340331-A1 · Nov 26, 2015 · US
Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate
US-9196562-B2 · Nov 24, 2015 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/019?
- CPC H10W72/019 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10W72/019 (Electricity)?
- Our database includes 8,660 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/019 growing?
- Publication counts under this code: 889 in 2024 vs 790 in 2025 (latest complete years).