Component and method of manufacturing a component using an ultrathin carrier
US-2025157857-A1 · May 15, 2025 · US
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Roesner Michael patents
Roesner Michael is listed as an inventor on 51 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Roesner Michael |
| Total patents | 51 |
| First publication | Mar 5, 2015 |
| Latest publication | May 15, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device with metal silicide layer
US-2023317666-A1 · Oct 5, 2023 · US
Component and Method of Manufacturing a Component Using an Ultrathin Carrier
US-2022246475-A1 · Aug 4, 2022 · US
Component and method of manufacturing a component using an ultrathin carrier
US-11367654-B2 · Jun 21, 2022 · US
Silicon carbide devices and methods for manufacturing the same
US-11282805-B2 · Mar 22, 2022 · US
Methods of forming a silicon-insulator layer and semiconductor device having the same
US-11195713-B2 · Dec 7, 2021 · US
Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamber
US-11077525-B2 · Aug 3, 2021 · US
Semiconductor devices including a metal silicide layer and methods for manufacturing thereof
US-11063014-B2 · Jul 13, 2021 · US
Integrated circuit substrate and method for manufacturing the same
US-10672716-B2 · Jun 2, 2020 · US
Magnetic phase change material for heat dissipation
US-10643917-B2 · May 5, 2020 · US
Recent patents
Latest publications not already listed above.
Segmented edge protection shield
US-10622218-B2 · Apr 14, 2020 · US
Methods of Forming a Silicon-Insulator Layer and Semiconductor Device Having the Same
US-2019385842-A1 · Dec 19, 2019 · US
Semiconductor Devices Including a Metal Silicide Layer and Methods for Manufacturing Thereof
US-2019355691-A1 · Nov 21, 2019 · US
Method of Processing a Silicon Carbide Containing Crystalline Substrate, Silicon Carbide Chip, and Processing Chamber
US-2019308274-A1 · Oct 10, 2019 · US
Silicon Carbide Devices and Methods for Manufacturing the Same
US-2019295981-A1 · Sep 26, 2019 · US
Method of processing a porous conductive structure in connection to an electronic component on a substrate
US-10373868-B2 · Aug 6, 2019 · US
Component and Method of Manufacturing a Component Using an Ultrathin Carrier
US-2019148233-A1 · May 16, 2019 · US
Magnetic Phase Change Material for Heat Dissipation
US-2019096780-A1 · Mar 28, 2019 · US
Component and method of manufacturing a component using an ultrathin carrier
US-10186458-B2 · Jan 22, 2019 · US
Methods for processing a semiconductor workpiece
US-10157765-B2 · Dec 18, 2018 · US
Integrated Circuit Substrate and Method for Manufacturing the Same
US-2018315713-A1 · Nov 1, 2018 · US
Plasma dicing of silicon carbide
US-10032670-B2 · Jul 24, 2018 · US
Integrated circuit substrate and method for manufacturing the same
US-10020264-B2 · Jul 10, 2018 · US
Method for simultaneous structuring and chip singulation
US-10005659-B2 · Jun 26, 2018 · US
Source down semiconductor devices and methods of formation thereof
US-9911686-B2 · Mar 6, 2018 · US
Segmented edge protection shield
US-2018005838-A1 · Jan 4, 2018 · US
Plasma dicing of silicon carbide
US-2017358494-A1 · Dec 14, 2017 · US
Segmented edge protection shield
US-9793129-B2 · Oct 17, 2017 · US
Method for processing a substrate and an electronic device
US-2017207123-A1 · Jul 20, 2017 · US
Method of dicing a wafer
US-9704748-B2 · Jul 11, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 48 |
| Univ Graz Tech | 2 |
| Infineon Technologies Austria Ag | 2 |
| Mayer Karl | 1 |
| Napetschnig Evelyn | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P54/00 | 35 |
| H01L21/78 | 32 |
| H10W90/736 | 15 |
| H10W72/884 | 14 |
| H10W90/756 | 14 |