Plasma dicing of silicon carbide

Patent metadata

Field	Value
Publication number	US-10032670-B2
Application number	US-201615182387-A
Country	US
Kind code	B2
Filing date	Jun 14, 2016
Priority date	Jun 14, 2016
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

A method of forming a semiconductor device includes forming an active region in a first side of a silicon carbide substrate, the silicon carbide substrate having a second side opposite the first side and forming a contact pad at the first side. The contact pad is coupled to the active region. The method further includes forming an etch stop layer over the contact pad and plasma dicing the silicon carbide substrate from the second side. The plasma dicing etches through the silicon carbide substrate and stops on the etch stop layer. The diced silicon carbide substrate is held together by the etch stop layer. The diced silicon carbide substrate is attached on a carrier. The diced silicon carbide substrate is separated into silicon carbide dies by cleaving the etch stop layer.

First claim

What is claimed is:

1. A method of forming a semiconductor device, the method comprising:
forming an active region in a first side of a silicon carbide substrate, the silicon carbide substrate comprising a second side opposite the first side;
forming a contact pad at the first side of the silicon carbide substrate, the contact pad being coupled to the active region;
after forming the contact pad, forming an etch stop layer over the contact pad;
plasma dicing the silicon carbide substrate from the second side, the plasma dicing etching through the silicon carbide substrate and stopping on the etch stop layer, the diced silicon carbide substrate being held together by the etch stop layer;
attaching the diced silicon carbide substrate on a carrier;
from the first side, forming a contact opening in the etch stop layer after the plasma dicing, the contact opening exposing the contact pad formed at the first side of the silicon carbide substrate; and
after exposing the contact pad, separating the diced silicon carbide substrate into silicon carbide dies by cleaving the etch stop layer.

2. The method of claim 1 , wherein the plasma dicing comprises an etch chemistry that selectively etches the silicon carbide substrate relative to the etch stop layer.

3. The method of claim 1 , wherein, during the plasma dicing, an etch rate of the silicon carbide substrate when exposed to the plasma of the plasma dicing is between 10 μm/minute to 30 μm/minute.

4. The method of claim 3 , wherein an etch rate of the etch stop layer when exposed to the plasma of the plasma dicing is between 0.01 μm/minute to 0.1 μm/minute.

5. The method of claim 1 , wherein cleaving the etch stop layer comprises separation by mechanical force.

6. The method of claim 1 , wherein cleaving the etch stop layer comprises sawing the etch stop layer or stealth dicing the etch stop layer.

7. The method of claim 1 , wherein forming an etch stop layer over the contact pad comprises coating a liquid layer over the silicon carbide substrate, curing the liquid layer, and polishing the cured liquid layer to form a planar surface.

8. The method of claim 1 , wherein forming an etch stop layer over the contact pad comprises stencil printing the etch stop layer, the contact pad remains open after the stencil printing.

9. The method of claim 1 , wherein the carrier comprises a frame with a tape.

10. The method of claim 1 , wherein the silicon carbide substrate comprises a first major surface at the first side and a second major surface at the second side, wherein the silicon carbide substrate is a monocrystalline material, and wherein the first major surface is a (100) crystal plane surface.

11. The method of claim 1 , further comprising:
grinding the silicon carbide substrate from the second side before the plasma dicing.

12. The method of claim 1 , wherein the etch stop layer comprises a ceramic material.

13. The method of claim 1 , wherein the plasma dicing using a plasma etching tool comprising:
a plasma chamber;
an inlet for an inter-halogen gas;
an outlet for the inter-halogen gas;
electrodes for generating a plasma from the inter-halogen gas; and
a heating unit for heating a wafer to be etched using the plasma.

14. The method of claim 1 , the etch stop layer comprising alumina, yttria, aluminium nitride, aluminium oxide, yttrium nitride, or yttrium oxide.

15. A method of forming a power semiconductor device, the method comprising:
providing a silicon carbide substrate comprising a first side and a second side opposite the first side;
doping a portion of the silicon carbide substrate to form an active region from the first side;
forming a contact pad at the first side of the silicon carbide substrate, the contact pad being coupled to the active region;
forming a patterned protective layer covering the contact pad;
forming a ceramic stabilization layer over the active region and the contact pad, the ceramic stabilization layer configured to provide mechanical stabilization and support, the ceramic stabilization layer disposed between adjacent regions of the patterned protective layer;
from the second side, thinning the silicon carbide substrate to expose a major surface;
forming a patterned mask layer under the exposed major surface of the silicon carbide substrate;
placing the silicon carbide substrate with the patterned mask layer within a plasma chamber and heating the silicon carbide substrate to a temperature greater than 300° C.;
using an etch chemistry comprising an interhalogen compound comprising chlorine and fluorine and the patterned mask layer as an etch mask, etching through the silicon carbide substrate to expose the ceramic stabilization layer; and
removing the patterned protective layer after the etching.

16. The method of claim 15 , wherein the interhalogen compound is chlorine tetrafluoride.

17. The method of claim 15 , wherein the etch chemistry selectively etches the silicon carbide substrate relative to the ceramic stabilization layer.

18. The method of claim 15 , further comprising:
after the etching, attaching a flexible carrier to the exposed major surface of the silicon carbide substrate; and
cleaving the ceramic stabilization layer to form a plurality of silicon carbide dies, wherein each of the plurality of silicon carbide dies comprising a portion of the ceramic stabilization layer and a portion of the silicon carbide substrate.

19. The method of claim 18 , wherein cleaving the ceramic stabilization layer comprises separation by mechanical force.

20. The method of claim 18 , wherein cleaving the ceramic stabilization layer comprises sawing the ceramic stabilization layer or stealth dicing the ceramic stabilization layer.

21. The method of claim 15 , wherein the etching is performed in a plasma etching tool comprising:
a plasma chamber;
an inlet for an inter-halogen gas;
an outlet for the inter-halogen gas;
electrodes for generating a plasma from the inter-halogen gas; and
a heating unit for heating a wafer to be etched using the plasma.

22. A method of forming a power semiconductor device, the method comprising:
providing a silicon carbide substrate comprising a first side and a second side opposite the first side;
doping a portion of the silicon carbide substrate to form an active region from the first side;
forming a contact pad at the first side of the silicon carbide substrate, the contact pad being coupled to the active region;
forming a patterned protective layer covering the contact pad;
forming a ceramic stabilization layer over the active region and the contact pad, the ceramic stabilization layer configured to provide mechanical stabilization and support, the ceramic stabilization layer disposed between adjacent regions of the patterned protective layer;
removing the patterned protective layer to form the ceramic stabilization layer with a contact opening exposing the contact pad;
flipping the silicon carbide substrate and placing the ceramic stabilization layer with the contact opening over a carrier, the carrier comprising a recess to hold the silicon carbide substrate;
applying a high temperature glue along sidewalls of the silicon carbide substrate contacting the carrier to form a seal;
from the second side, thinning the silicon carbide substrate to expose a major surface;
forming a patterned mask layer under the exposed major surface of the silicon carbide substrate;
placing the silicon carbide substrate with the patterned mask laye

Assignees

• Infineon Technologies Ag

Inventors

• Roesner Michael
• Engelhardt Manfred
• Stranzl Gudrun

Classifications

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0421

  for drying etching · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title