Segmented edge protection shield

Patent metadata

Field	Value
Publication number	US-9793129-B2
Application number	US-201514717780-A
Country	US
Kind code	B2
Filing date	May 20, 2015
Priority date	May 20, 2015
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

A segmented edge protection shield for plasma dicing a wafer. The segmented edge protection shield includes an outer structure and a plurality of plasma shield edge segments. The outer structure defines an interior annular edge configured to correspond to the circumferential edge of the wafer. Each one of the plurality of plasma shield edge segments is defined by an inner edge and side edges. The inner edge is interior to and concentric to the annular edge of the outer structure. The side edges extend between the inner edge and the annular edge.

First claim

What is claimed is:

1. A segmented edge protection shield for plasma dicing a wafer, comprising:
an outer structure that defines an interior annular edge configured to correspond to the circumferential edge of the wafer, wherein the annular edge comprises a continuous ring-shaped surface;
a plurality of plasma shield edge segments contacting the annular edge, wherein each one of the plurality of plasma shield edge segments is defined by an inner edge that is interior to and concentric to the annular edge and side edges that extend between the inner edge and the annular edge; and
a plurality of gaps exposing portions of the annular edge between adjacent ones of the plurality of plasma shield edge segments.

2. The segmented edge protection shield of claim 1 , wherein the side edges of adjacent ones of the plurality of plasma shield edge segments are approximately parallel.

3. The segmented edge protection shield of claim 1 , wherein the side edges of the adjacent ones of the plurality of plasma shield edge segments intersect the annular edge.

4. The segmented edge protection shield of claim 1 , wherein a distance between the inner edge of the plurality of plasma shield edge segments and the annular edge is about 1 mm to about 10 mm.

5. The segmented edge protection shield of claim 1 , wherein a distance between the side edges of the adjacent ones of the plurality of plasma shield edge segments is about 1 mm to about 10 mm.

6. A wafer comprising:
a plurality of singulated dies, wherein each die of the plurality of singulated dies is separated from each other by a gap; and
a plurality of singulated wafer edge areas that are spaced apart around a circumferential edge of the wafer, wherein each of the plurality of singulated wafer edge areas is separated from each other by a gap, wherein each of the plurality of singulated wafer edge areas is larger than each of the plurality of singulated dies.

7. The wafer of claim 6 , wherein the plurality of singulated wafer edge areas comprise interconnected kerf lines of partial die that are adjacent to and exterior to a plurality of edge segments, wherein each one of the plurality of edge segments is defined by an inner edge that is concentric to the circumferential edge of the wafer and side edges that extend between the inner edge and the circumferential edge of the wafer.

8. The wafer of claim 7 , wherein the plurality of singulated wafer edge areas comprise the inner edge of the plurality of edge segments having a length that is greater than a maximum distance between adjacent kerf lines.

9. The wafer of claim 7 , wherein the plurality of singulated wafer edge areas comprise the side edges of the plurality of edge segments having a same length.

10. The wafer of claim 7 , wherein the singulated die comprise singulated die between the side edges of adjacent ones of the plurality of edge segments, wherein a distance between the side edges of the adjacent ones of the plurality of edge segments is greater than a maximum distance between adjacent kerf lines.

11. The wafer of claim 7 , wherein a distance between the inner edge of the plurality of edge segments and the circumferential edge of the wafer is about 1 mm to about 10 mm.

12. The wafer of claim 7 , wherein a distance between the side edges of the adjacent ones of the plurality of edge segments is about 1 mm to about 10 mm.

13. A segmented edge protection shield for plasma dicing a wafer, comprising:
an outer structure that defines an interior annular edge configured to correspond to the circumferential edge of the wafer; and
a plurality of plasma shield edge segments contacting the annular edge, wherein each one of the plurality of plasma shield edge segments is defined by an inner edge that is interior to and concentric to the annular edge and side edges that extend between the inner edge and the annular edge, wherein the outer structure comprises a plurality of structures joining adjacent ones of the plurality of plasma shield edge segments, wherein the total number of the plurality of structures is the same as the total number of the plurality of plasma shield edge segments.

Assignees

• Infineon Technologies Ag

Inventors

• Engelhardt Manfred
• Roesner Michael
• Ehrentraut Georg

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P50/242 Primary

  of Group IV materials · CPC title

• H01J37/32642

  Focus rings · CPC title

• H01J37/32651

  Shields, e.g. dark space shields, Faraday shields · CPC title