Coated semiconductor dies
US-12525500-B2 · Jan 13, 2026 · US
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Manack Christopher Daniel patents
Manack Christopher Daniel is listed as an inventor on 111 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Manack Christopher Daniel |
| Total patents | 111 |
| First publication | Jan 1, 2015 |
| Latest publication | Jan 13, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Laser ablation for die separation to reduce laser splash and electronic device
US-12512416-B2 · Dec 30, 2025 · US
Inductor module with packaged semiconductor die
US-2025372548-A1 · Dec 4, 2025 · US
Efficient removal of street test devices during wafer dicing
US-2025372454-A1 · Dec 4, 2025 · US
Efficient removal of street test devices during wafer dicing
US-12394671-B2 · Aug 19, 2025 · US
Electronic devices in semiconductor package cavities
US-2025218886-A1 · Jul 3, 2025 · US
Miniature sensor cavities
US-2025164296-A1 · May 22, 2025 · US
Electronic devices in semiconductor package cavities
US-12255115-B2 · Mar 18, 2025 · US
Contact with bronze material to mitigate undercut
US-12237219-B2 · Feb 25, 2025 · US
Efficient redistribution layer topology
US-2025029943-A1 · Jan 23, 2025 · US
Recent patents
Latest publications not already listed above.
Miniature sensor cavities
US-12203776-B2 · Jan 21, 2025 · US
Die attach surface copper layer with protective layer for microelectronic devices
US-2024421045-A1 · Dec 19, 2024 · US
Conductive members for die attach in flip chip packages
US-2024413114-A1 · Dec 12, 2024 · US
Efficient redistribution layer topology
US-12142586-B2 · Nov 12, 2024 · US
Conductive members for die attach in flip chip packages
US-12100678-B2 · Sep 24, 2024 · US
Die attach surface copper layer with protective layer for microelectronic devices
US-12074096-B2 · Aug 27, 2024 · US
Plating for thermal management
US-12068221-B2 · Aug 20, 2024 · US
Three dimensional package for semiconductor devices and external components
US-12062597-B2 · Aug 13, 2024 · US
Electronic devices in semiconductor package cavities
US-2024234231-A1 · Jul 11, 2024 · US
Integrated circuit with metal stop ring outside the scribe seal
US-12009319-B2 · Jun 11, 2024 · US
Method of forming brass-coated metals in flip-chip redistribution layers
US-11984418-B2 · May 14, 2024 · US
Integrated system-in-package with radiation shielding
US-11978709-B2 · May 7, 2024 · US
Electronic devices in semiconductor package cavities
US-11942386-B2 · Mar 26, 2024 · US
Coated semiconductor dies
US-2024055313-A1 · Feb 15, 2024 · US
IC having a metal ring thereon for stress reduction
US-11869820-B2 · Jan 9, 2024 · US
Wafer chip scale packages with visible solder fillets
US-11855024-B2 · Dec 26, 2023 · US
Semicondutor package substrate with die cavity and redistribution layer
US-11854922-B2 · Dec 26, 2023 · US
Coated semiconductor dies
US-11837518-B2 · Dec 5, 2023 · US
Laser ablation for die separation to reduce laser splash and electronic device
US-2023387036-A1 · Nov 30, 2023 · US
Three dimensional package for semiconductor devices and external components
US-2023352373-A1 · Nov 2, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Texas Instruments Inc | 111 |
| Texas Instruments Deutschland | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/252 | 60 |
| H10W72/952 | 51 |
| H10W72/222 | 46 |
| H10W72/923 | 45 |
| H10W72/29 | 44 |