Die attach surface copper layer with protective layer for microelectronic devices

Patent metadata

Field	Value
Publication number	US-12074096-B2
Application number	US-202016793887-A
Country	US
Kind code	B2
Filing date	Feb 18, 2020
Priority date	Oct 5, 2017
Publication date	Aug 27, 2024
Grant date	Aug 27, 2024

Abstract

A microelectronic device is formed by thinning a substrate of the microelectronic device from a die attach surface of the substrate, and forming a copper-containing layer on the die attach surface of the substrate. A protective metal layer is formed on the copper-containing layer. Subsequently, the copper-containing layer is attached to a package member having a package die mount area. The protective metal layer may optionally be removed prior to attaching the copper-containing layer to the package member. Alternatively, the protective metal layer may be left on the copper-containing layer when the copper-containing layer is attached to the package member. A structure formed by the method is also disclosed.

First claim

What is claimed is:

1. A microelectronic device, comprising:
a substrate having a component surface and a die attach surface located opposite from the component surface;
a wire bond attached to the component surface;
a copper containing layer on the die attach surface, wherein the copper containing layer occupies more than 50% surface area of the die attach surface; and
a die attach material on the copper containing layer, wherein the copper containing layer is attached to a portion of a lead frame by the die attach material, wherein the copper containing layer is recessed from a lateral perimeter of the die attach surface in its entirety from a bottom view of the microelectronics device.

2. The microelectronic device of claim 1 , wherein the copper containing layer is 5 microns to 10 microns thick.

3. The microelectronic device of claim 1 , further comprising an intermediate layer between the copper containing layer and the die attach surface.

4. The microelectronic device of claim 3 , wherein the intermediate layer includes titanium.

5. The microelectronic device of claim 1 , further comprising a protective metal layer between the copper containing layer and the die attach material, the protective metal layer including at least one metal selected from the group consisting of tin, silver, and nickel.

6. The microelectronic device of claim 1 , wherein the die attach material includes solder.

7. A microelectronic device, comprising:
a substrate having a component surface and a die attach surface located opposite from the component surface, the component surface including an I/O pad;
a solder ball physically contacting the component surface, the solder ball attached to a lead;
a copper containing layer on the die attach surface, wherein the copper containing layer occupies more than 50% surface area of the die attach surface; and
a die attach material on the copper containing layer, wherein the copper containing layer is attached to a portion of a lead frame by the die attach material, wherein the copper containing layer is recessed from a lateral perimeter of the die attach surface in its entirety from a bottom view of the microelectronics device.

8. The microelectronic device of claim 7 , wherein the copper containing layer is 5 microns to 10 microns thick.

9. The microelectronic device of claim 7 , further comprising an intermediate layer between the copper containing layer and the die attach surface.

10. The microelectronic device of claim 9 , wherein the intermediate layer includes titanium.

11. The microelectronic device of claim 7 , further comprising a protective metal layer between the copper containing layer and the die attach material, the protective metal layer including at least one metal selected from the group consisting of tin, silver, and nickel.

12. The microelectronic device of claim 7 , wherein the die attach material includes solder.

Assignees

• Texas Instruments Inc

Inventors

• Manack Christopher Daniel
• Dadvand Nazila
• Pavone Salvatore

Classifications

• H10W72/075

  of bond wires · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title