Grain structure engineering for metal gapfill materials
US-12588533-B2 · Mar 24, 2026 · US
This page is not indexed by search engines while we improve data quality.
Lianto Prayudi patents
Lianto Prayudi is listed as an inventor on 50 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lianto Prayudi |
| Total patents | 50 |
| First publication | Jan 4, 2018 |
| Latest publication | Mar 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Defect classification of processed wafers
US-12518367-B2 · Jan 6, 2026 · US
Water vapor plasma to enhance surface hydrophilicity
US-12469683-B2 · Nov 11, 2025 · US
Silicon (Si) dry etch for die-to-wafer thinning
US-12424446-B2 · Sep 23, 2025 · US
Formation of Inductor Core Stacks Using Self-Assembled Monolayers
US-2025273392-A1 · Aug 28, 2025 · US
Selective Dielectric Capping for Hybrid Bonding
US-2025149474-A1 · May 8, 2025 · US
Polishing articles for hybrid bonding applications
US-2025121472-A1 · Apr 17, 2025 · US
DIE BACKSIDE PROFILE for SEMICONDUCTOR DEVICES
US-2025062129-A1 · Feb 20, 2025 · US
Grain Structure Engineering for Metal Gapfill Materials
US-2025038137-A1 · Jan 30, 2025 · US
Method and apparatus for substrate cleaning in stack-die hybrid bonding process
US-2024390950-A1 · Nov 28, 2024 · US
Recent patents
Latest publications not already listed above.
Methods and apparatus for processing a substrate
US-12138742-B2 · Nov 12, 2024 · US
Methods for depositing dielectric films with increased stability
US-2024332005-A1 · Oct 3, 2024 · US
Automation method for defect characterization for hybrid bonding application
US-2024330671-A1 · Oct 3, 2024 · US
Pre-bonding automatic optical inspection defect classification
US-2024331131-A1 · Oct 3, 2024 · US
Post bonding aoi defect classification
US-2024331126-A1 · Oct 3, 2024 · US
Silicon (Si) Dry Etch for Die-to-Wafer Thinning
US-2024213028-A1 · Jun 27, 2024 · US
Methods and apparatus for processing a substrate
US-12020992-B2 · Jun 25, 2024 · US
Selective Deposition of Thin Films with Improved Stability
US-2024110284-A1 · Apr 4, 2024 · US
Planarization methods for packaging substrates
US-11931855-B2 · Mar 19, 2024 · US
Methods for forming alignment marks
US-2024069448-A1 · Feb 29, 2024 · US
Methods for forming alignment marks
US-11899376-B1 · Feb 13, 2024 · US
Diffusion layers in metal interconnects
US-11901225-B2 · Feb 13, 2024 · US
Methods and apparatus for processing a substrate
US-2023238287-A1 · Jul 27, 2023 · US
Water vapor plasma to enhance surface hydrophilicity
US-2023100863-A1 · Mar 30, 2023 · US
Diffusion layers in metal interconnects
US-2023077737-A1 · Mar 16, 2023 · US
Methods and apparatus for controlling warpage in wafer level packaging processes
US-11421316-B2 · Aug 23, 2022 · US
Methods and apparatus for processing a substrate
US-2022258304-A1 · Aug 18, 2022 · US
Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applications
US-11355358-B2 · Jun 7, 2022 · US
Method of fine redistribution interconnect formation for advanced packaging applications
US-11342256-B2 · May 24, 2022 · US
Methods for bonding substrates
US-11309278-B2 · Apr 19, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 50 |
| Nat Univ Singapore | 4 |
| Univ Nanyang Tech | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/60 | 12 |
| H10W99/00 | 11 |
| H10W72/0198 | 10 |
| H10W80/327 | 9 |
| H10P52/00 | 8 |