Semiconductor chip for bonding semiconductor device, and bonding semiconductor device and electronic system including the same
US-2025372517-A1 · Dec 4, 2025 · US
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Jung Kwangyoung patents
Jung Kwangyoung is listed as an inventor on 32 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Jung Kwangyoung |
| Total patents | 32 |
| First publication | Jan 31, 2019 |
| Latest publication | Dec 4, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Junction temperature estimation device and plasma generating system including the same
US-12490368-B2 · Dec 2, 2025 · US
Semiconductor device
US-2025212400-A1 · Jun 26, 2025 · US
Semiconductor device
US-12279421-B2 · Apr 15, 2025 · US
Semiconductor devices and data storage systems including the same
US-2025107092-A1 · Mar 27, 2025 · US
Junction temperature estimation device and plasma generating system including the same
US-2025106975-A1 · Mar 27, 2025 · US
Semiconductor device and data storage system including the same
US-2025056808-A1 · Feb 13, 2025 · US
Semiconductor device having dummy structures in a peripheral region and data storage system including the same
US-12185548-B2 · Dec 31, 2024 · US
Semiconductor devices comprising crack preventing layers and data storage systems including the same
US-12185543-B2 · Dec 31, 2024 · US
Three-dimensional semiconductor memory device and electronic system including the same
US-2024422975-A1 · Dec 19, 2024 · US
Recent patents
Latest publications not already listed above.
Three-dimensional (3d) semiconductor memory device
US-2024341099-A1 · Oct 10, 2024 · US
Three-dimensional (3D) semiconductor memory device
US-12022658-B2 · Jun 25, 2024 · US
Semiconductor device, method of manufacturing the same, and massive data storage system including the same
US-11856770-B2 · Dec 26, 2023 · US
Three-dimensional (3d) semiconductor memory device
US-2023371260-A1 · Nov 16, 2023 · US
Rf generator with carbonization prevention system
US-2023360881-A1 · Nov 9, 2023 · US
Three-dimensional (3D) semiconductor memory device
US-11778834-B2 · Oct 3, 2023 · US
Semiconductor device
US-2023262972-A1 · Aug 17, 2023 · US
Semiconductor devices
US-11641743-B2 · May 2, 2023 · US
Semiconductor device
US-11616070-B2 · Mar 28, 2023 · US
Three-dimensional (3d) semiconductor memory device
US-2023076039-A1 · Mar 9, 2023 · US
Semiconductor devices and data storage systems including the same
US-2023005955-A1 · Jan 5, 2023 · US
Three-dimensional (3D) semiconductor memory device
US-11521981-B2 · Dec 6, 2022 · US
Three-dimensional semiconductor memory device and electronic system including the same
US-2022359563-A1 · Nov 10, 2022 · US
Semiconductor device, method of manufacturing the same, and massive data storage system including the same
US-2022139945-A1 · May 5, 2022 · US
Semiconductor device and data storage system including the same
US-2022102369-A1 · Mar 31, 2022 · US
Semiconductor devices
US-2022037347-A1 · Feb 3, 2022 · US
Semiconductor device
US-2021384210-A1 · Dec 9, 2021 · US
Three-dimensional (3d) semiconductor memory device
US-2021358935-A1 · Nov 18, 2021 · US
Semiconductor devices
US-11177282-B2 · Nov 16, 2021 · US
Semiconductor devices
US-2020335520-A1 · Oct 22, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 32 |
| Rftsi Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.