Fill of vias in single and dual damascene structures using self-assembled monolayer
US-12598977-B2 · Apr 7, 2026 · US
This page is not indexed by search engines while we improve data quality.
Jezewski Christopher patents
Jezewski Christopher is listed as an inventor on 58 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Jezewski Christopher |
| Total patents | 58 |
| First publication | Oct 20, 2015 |
| Latest publication | Apr 7, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Interconnect line structures with metal chalcogenide cap materials
US-12525488-B2 · Jan 13, 2026 · US
Selective laser treatments for transition metal dichalcogenide based transistor structures
US-2026006877-A1 · Jan 1, 2026 · US
Composite insulator films with low electrical leakage & high charge capacitance
US-2025385047-A1 · Dec 18, 2025 · US
Subtractively patterned interconnect structures for integrated circuits
US-12482744-B2 · Nov 25, 2025 · US
Low resistivity conductor subtractively patterned interconnects using layer transfer of microstructure engineered thin films
US-2025309100-A1 · Oct 2, 2025 · US
Integrated circuit interconnect structures with graphene cap
US-12394716-B2 · Aug 19, 2025 · US
Defect self-compensation materials for high endurance (anti-)ferroelectric capacitors with hafnium oxide based material systems
US-2025220932-A1 · Jul 3, 2025 · US
Source/drain contact trench with dielectric liner on contact metal
US-2025220958-A1 · Jul 3, 2025 · US
Incorporation of semiconductor doping materials in metal contacts via reactive sputtering
US-2025212441-A1 · Jun 26, 2025 · US
Recent patents
Latest publications not already listed above.
Cmos metal contacts with dopant diffusion barriers
US-2025212507-A1 · Jun 26, 2025 · US
Integrated circuits and methods for forming thin film crystal layers
US-12211794-B2 · Jan 28, 2025 · US
Integrated circuit interconnect structures with ultra-thin metal chalcogenide barrier materials
US-12165917-B2 · Dec 10, 2024 · US
Interconnect techniques for electrically connecting source/drain regions of stacked transistors
US-12107085-B2 · Oct 1, 2024 · US
Transistor channel passivation with 2D crystalline material
US-12107170-B2 · Oct 1, 2024 · US
Subtractively patterned interconnect structures for integrated circuits
US-2024304543-A1 · Sep 12, 2024 · US
Subtractively patterned interconnect structures for integrated circuits
US-12027458-B2 · Jul 2, 2024 · US
Transistors with metal chalcogenide channel materials
US-11888034-B2 · Jan 30, 2024 · US
Low-resistance and thermally stable contacts with phosphide or arsenide metal compound layers
US-2024006506-A1 · Jan 4, 2024 · US
Low-resistance and thermally stable contacts with boride, indium, or gallium metal compound layers
US-2024006533-A1 · Jan 4, 2024 · US
Integrated circuits and methods for forming integrated circuits
US-11830788-B2 · Nov 28, 2023 · US
Interconnect techniques for electrically connecting source/drain regions of stacked transistors
US-2023352481-A1 · Nov 2, 2023 · US
Cladded metal interconnects
US-11749560-B2 · Sep 5, 2023 · US
Interconnect techniques for electrically connecting source/drain regions of stacked transistors
US-11742346-B2 · Aug 29, 2023 · US
Interconnect line structures with metal chalcogenide cap materials
US-2023197512-A1 · Jun 22, 2023 · US
Fill of vias in single and dual damascene structures using self-assembled monolayer
US-2023197601-A1 · Jun 22, 2023 · US
Selectable vias for back end of line interconnects
US-11670588-B2 · Jun 6, 2023 · US
Staggered lines for interconnect performance improvement and processes for forming such
US-11664305-B2 · May 30, 2023 · US
Contact stacks to reduce hydrogen in semiconductor devices
US-11637185-B2 · Apr 25, 2023 · US
Integrated circuit interconnect structures with graphene cap
US-2022415818-A1 · Dec 29, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 58 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/42 | 26 |
| H01L23/5226 | 25 |
| H10W20/056 | 19 |
| H10D30/6757 | 18 |
| H10W20/033 | 17 |