Digital to analog conversion system and digital to analog conversion method
US-2026100721-A1 · Apr 9, 2026 · US
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Chiu Yu-Ting patents
Chiu Yu-Ting is listed as an inventor on 27 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chiu Yu-Ting |
| Total patents | 27 |
| First publication | Jul 2, 2015 |
| Latest publication | Apr 9, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Lamination apparatus and method
US-12485664-B2 · Dec 2, 2025 · US
Lamination apparatus
US-2025360704-A1 · Nov 27, 2025 · US
Analog front-end device
US-12463610-B2 · Nov 4, 2025 · US
Electronic device and manufacturing method thereof
US-2024356199-A1 · Oct 24, 2024 · US
Electronic device and manufacturing method thereof
US-12062832-B2 · Aug 13, 2024 · US
Lamination apparatus and method
US-2024262096-A1 · Aug 8, 2024 · US
Optical Sensing Apparatus
US-2024063322-A1 · Feb 22, 2024 · US
Analog front-end device
US-2023025101-A1 · Jan 26, 2023 · US
Integrated fan-out package and manufacturing method thereof
US-11282810-B2 · Mar 22, 2022 · US
Recent patents
Latest publications not already listed above.
Electronic device and manufacturing method thereof
US-2021351491-A1 · Nov 11, 2021 · US
Electronic device and manufacturing method thereof
US-11075439-B2 · Jul 27, 2021 · US
Composite packaging material for lithium battery
US-2021098752-A1 · Apr 1, 2021 · US
Integrated fan-out package and manufacturing method thereof
US-2020335477-A1 · Oct 22, 2020 · US
Method of manufacturing integrated fan-out package
US-10756052-B2 · Aug 25, 2020 · US
Electronic device and manufacturing method thereof
US-2020044306-A1 · Feb 6, 2020 · US
Method of manufacturing integrated fan-out package
US-2019355694-A1 · Nov 21, 2019 · US
Method and system for mounting components in semiconductor fabrication process
US-10438922-B2 · Oct 8, 2019 · US
Method of manufacturing integrated fan-out package
US-10366966-B1 · Jul 30, 2019 · US
Proton exchange membrane and manufacturing method thereof
US-10276885-B2 · Apr 30, 2019 · US
Package structure, fan-out package structure and method of the same
US-10269582-B2 · Apr 23, 2019 · US
Package structure, fan-out package structure and method of the same
US-2018130673-A1 · May 10, 2018 · US
Package structure, fan-out package structure and method of the same
US-9870929-B2 · Jan 16, 2018 · US
Method and system for mounting components in semiconductor fabrication process
US-2017352641-A1 · Dec 7, 2017 · US
Proton exchange membrane and manufacturing method thereof
US-2017187058-A1 · Jun 29, 2017 · US
Package structure, fan-out package structure and method of the same
US-2017110403-A1 · Apr 20, 2017 · US
Method for repairing electronic device
US-2015183172-A1 · Jul 2, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 19 |
| Realtek Semiconductor Corp | 3 |
| Nat Univ Tsing Hua | 1 |
| Benq Materials Corp | 1 |
| Hon Hai Prec Ind Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/073 | 15 |
| H10W90/00 | 14 |
| H10W72/874 | 14 |
| H10W70/60 | 14 |
| H10W90/701 | 14 |