Package structure, fan-out package structure and method of the same

Patent metadata

Field	Value
Publication number	US-9870929-B2
Application number	US-201514882887-A
Country	US
Kind code	B2
Filing date	Oct 14, 2015
Priority date	Oct 14, 2015
Publication date	Jan 16, 2018
Grant date	Jan 16, 2018

Abstract

A package structure includes a spiral coil, a redistribution layer (RDL) and a molding material. The molding material fills gaps of the spiral coil. The spiral coil is connected to the RDL. A fan-out package structure includes a spiral coil, an RDL and a die. The spiral coil has a depth-to-width ratio greater than about 2. The RDL is connected to the spiral coil. The die is coupled to the spiral coil through the RDL. A semiconductor packaging method includes: providing a carrier; adhering a spiral coil on the carrier; adhering a die on the carrier; dispensing a molding material on the carrier to fill gaps between the spiral coil and the die; and disposing a redistribution layer (RDL) over the carrier so as to connect the spiral coil with the die.

First claim

What is claimed is:

1. A package structure, comprising:
a spiral coil comprising a plurality of turns;
a die comprising a plurality of connectors;
a redistribution layer (RDL); and
a molding material fills gaps between adjacent turns of the spiral coil;
wherein a top end of the spiral coil and a top end of the connectors of the die are connected to the RDL, and the top end of the spiral coil and the top end of the connectors of the die are level with each other.

2. The package structure of claim 1 , wherein a depth-to-width ratio of the spiral coil is greater than 2.

3. The package structure of claim 1 , wherein the spiral coil comprises copper (Cu).

4. The package structure of claim 1 , further comprising an upper spiral coil over the spiral coil.

5. The package structure of claim 1 , further comprising a die connected to the RDL so that the die is connected to the spiral coil through the RDL.

6. The package structure of claim 4 , further comprising a non-conductive film laid between the upper spiral coil and the spiral coil.

7. The package structure of claim 4 , wherein the upper spiral coil at least partially overlaps the spiral coil.

8. The package structure of claim 4 , wherein the upper spiral coil and the spiral coil are wound in a same direction.

9. The package structure of claim 4 , wherein the upper spiral coil is connected to the spiral coil through a contact.

10. The package structure of claim 4 , further comprising a die connected to the RDL so that the die is coupled to the upper spiral coil through the RDL.

11. A fan-out package structure, comprising:
a spiral coil having a depth-to-width ratio greater than 2;
a redistribution layer (RDL) connected to a top end of the spiral coil; and
a die comprising a plurality of connectors, and a top end of the connectors being coupled to the spiral coil through the RDL;
wherein the top end of the spiral coil and the top end of the connectors of the die are level with each other.

12. The fan-out package structure of claim 11 , further comprising a plurality of electrical connectors coupled to the RDL.

13. The fan-out package structure of claim 12 , wherein the electrical connectors include solder balls.

14. The fan-out package structure of claim 11 , further comprising a molding material fills gaps between the spiral coil and the die.

15. A package structure, comprising:
a carrier;
a spiral coil disposed over the carrier;
a redistribution layer (RDL) connected to a top end of the spiral coil; and
a molding material fills gaps between the carrier and the RDL;
a die comprising a plurality if connectors, and a top end of the connectors being coupled to the spiral coil through the RDL;
wherein the top end of the spiral coil and the top end of the connectors of the die are level with each other.

16. The package structure of claim 15 , further comprising an adhesive layer formed between the spiral coil and the carrier.

17. The package structure of claim 15 , further comprising an electrical connector over the RDL.

18. The package structure of claim 17 , wherein the spiral coil is coupled to the electrical connector through the RDL.

19. The package structure of claim 15 , wherein the spiral coil comprises copper (Cu).

20. The package structure of claim 18 further comprising an upper spiral coil over the spiral coil.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Hwang Chien Ling
• Liao Hsin-Hung
• Chiu Yu-Ting

Classifications

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10W90/728

  between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors · CPC title

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W72/07253

  changes in shapes · CPC title