Hybrid core substrate with embedded components
US-12593705-B2 · Mar 31, 2026 · US
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Bchir Omar James patents
Bchir Omar James is listed as an inventor on 33 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Bchir Omar James |
| Total patents | 33 |
| First publication | Mar 5, 2015 |
| Latest publication | Mar 31, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Optoelectronic module package
US-12453210-B2 · Oct 21, 2025 · US
Integrated device with conductive pillar structure for die interconnection
US-2025300056-A1 · Sep 25, 2025 · US
Package substrate
US-2025300050-A1 · Sep 25, 2025 · US
Embedded scaffold stiffener in substrate
US-2025273597-A1 · Aug 28, 2025 · US
Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (ic) packages and fabrication methods
US-2024371736-A1 · Nov 7, 2024 · US
Hybrid core substrate with embedded components
US-2024339414-A1 · Oct 10, 2024 · US
Optoelectronic module package
US-2022262962-A1 · Aug 18, 2022 · US
Optoelectronic module package
US-2022109075-A1 · Apr 7, 2022 · US
Optoelectronic module package
US-11239377-B2 · Feb 1, 2022 · US
Recent patents
Latest publications not already listed above.
Optoelectronic module package
US-2019044002-A1 · Feb 7, 2019 · US
Embedded thin film magnetic carrier for integrated voltage regulator
US-10199152-B2 · Feb 5, 2019 · US
Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability
US-9806063-B2 · Oct 31, 2017 · US
Substrate and method of forming the same
US-9679841-B2 · Jun 13, 2017 · US
Embedded bridge structure in a substrate
US-9642259-B2 · May 2, 2017 · US
Package substrate comprising surface interconnect and cavity comprising electroless fill
US-9609751-B2 · Mar 28, 2017 · US
Semiconductor package with embedded components and method of making the same
US-9601435-B2 · Mar 21, 2017 · US
Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability
US-2016322332-A1 · Nov 3, 2016 · US
Package-on-package structure with reduced height
US-9484327-B2 · Nov 1, 2016 · US
Semiconductor package with embedded components and method of making the same
US-2016218064-A1 · Jul 28, 2016 · US
System, apparatus, and method for split die interconnection
US-9379090-B1 · Jun 28, 2016 · US
Techniques for controlling equivalent series resistance of a capacitor
US-2016183386-A1 · Jun 23, 2016 · US
Package substrate with testing pads on fine pitch traces
US-9370097-B2 · Jun 14, 2016 · US
Embedded thin film magnetic carrier for integrated voltage regulator
US-2016163443-A1 · Jun 9, 2016 · US
Package on package (PoP) integrated device comprising a plurality of solder resist layers
US-9355898-B2 · May 31, 2016 · US
System, apparatus, and method of interconnection in a substrate
US-2016093567-A1 · Mar 31, 2016 · US
PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A PLURALITY OF SOLDER RESIST LAYERS
US-2016035622-A1 · Feb 4, 2016 · US
Substrate and method of forming the same
US-2015333004-A1 · Nov 19, 2015 · US
Package substrate comprising surface interconnect and cavity comprising electroless fill
US-2015296616-A1 · Oct 15, 2015 · US
Ultra fine pitch and spacing interconnects for substrate
US-9159670-B2 · Oct 13, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qualcomm Inc | 28 |
| Rockley Photonics Ltd | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 23 |
| H10W70/685 | 19 |
| H10W70/635 | 15 |
| H10W70/65 | 14 |
| H10W90/401 | 14 |