Techniques for controlling equivalent series resistance of a capacitor

Patent metadata

Field	Value
Publication number	US-2016183386-A1
Application number	US-201514617864-A
Country	US
Kind code	A1
Filing date	Feb 9, 2015
Priority date	Dec 19, 2014
Publication date	Jun 23, 2016
Grant date	—

Abstract

Methods and apparatus for controlling an equivalent-series resistance (ESR) of a capacitor are provided. An exemplary apparatus includes a substrate having a land side, the capacitor mounted on the land side of the substrate and having both the ESR and terminals, a resistive pattern coupled to the terminals, and a plurality of vias coupled to the resistive pattern. The resistive pattern is configured to control the ESR. The resistive pattern can be formed of a resistive paste. The resistive pattern can be formed in a substantially semicircular shape having an arc ranging from substantially 45 degrees to substantially 135 degrees. The capacitor can be a surface mount device. The resistive pattern can be formed in a shape of a land-side capacitor mounting pad, a via, or both.

First claim

What is claimed is:

1 . An apparatus, comprising:
a substrate having a land side; a capacitor mounted on the land side of the substrate and having an equivalent series resistance (ESR) and terminals; a resistive pattern coupled to the terminals; and a plurality of vias coupled to the resistive pattern, wherein the resistive pattern is configured to control the ESR.

2 . The apparatus of claim 1 , wherein the resistive pattern is formed of a resistive paste.

3 . The apparatus of claim 1 , wherein the resistive pattern is formed in a substantially semicircular shape having an arc ranging from substantially 45 degrees to substantially 135 degrees.

4 . The apparatus of claim 1 , wherein the resistive pattern is formed in a substantially semicircular shape that is substantially centered on an axis and varies in cross-section along a radius extending from the axis.

5 . The apparatus of claim 1 , wherein the resistive pattern has a substantially right-angle bend.

6 . The apparatus of claim 1 , wherein the resistive pattern is formed in a shape of a land-side capacitor mounting pad, a via, or both.

7 . The apparatus of claim 1 , wherein the capacitor includes at least one electrically conductive mounting pad, electrically conductive pin, or electrically conductive ball.

8 . The apparatus of claim 1 , wherein the capacitor is a surface mount device.

9 . The apparatus of claim 1 , further comprising a base station of which the apparatus is a constituent part, a mobile device of which the apparatus is a constituent part, or both.

10 . A method for fabricating a capacitor pad formed of conductive paste, comprising:
forming a via in a substrate; forming a patterned resist layer on the via; removing a portion of the patterned resist layer adjacent to the via to define a cavity adjacent to the via; at least partially filling the cavity with conductive paste; and mounting an electrical contact of a capacitor to the conductive paste.

11 . The method of claim 10 , wherein the conductive paste is formed in a substantially semicircular shape having an arc ranging from substantially 45 degrees to substantially 135 degrees.

12 . The method of claim 10 , wherein the conductive paste is formed in a substantially semicircular shape that is substantially centered on an axis and varies in cross-section along a radius extending from the axis.

13 . The method of claim 10 , wherein the conductive paste is formed in a substantially right-angle bend.

14 . The method of claim 10 , wherein the electrical contact of the capacitor includes at least one electrically conductive mounting pad, electrically conductive pin, or electrically conductive ball.

15 . The method of claim 10 , wherein the capacitor is a surface mount device.

16 . The method of claim 10 , further comprising integrating the substrate into a base station, integrating the substrate into a mobile device, or both.

17 . A method for fabricating a capacitor pad and a via, comprising:
forming, on a substrate, a laminated layer including a cavity defining the via and the capacitor pad; forming a patterned resist layer on the laminated layer, wherein the patterned resist layer has a pattern; at least partially filling, through the pattern in the patterned resist layer, the cavity with a conductive paste; removing the patterned resist layer; and mounting an electrical contact of a capacitor to the conductive paste.

18 . The method of claim 17 , wherein the conductive paste is formed in a substantially semicircular shape having an arc ranging from substantially 45 degrees to substantially 135 degrees.

19 . The method of claim 17 , wherein the conductive paste is formed in a substantially semicircular shape that is substantially centered on an axis and varies in cross-section along a radius extending from the axis.

20 . The method of claim 17 , wherein the conductive paste is formed in a substantially right-angle bend.

21 . The method of claim 17 , wherein the electrical contact of the capacitor includes at least one electrically conductive mounting pad, electrically conductive pin, or electrically conductive ball.

22 . The method of claim 17 , wherein the capacitor is a surface mount device.

23 . The method of claim 17 , further comprising integrating the substrate into a base station, integrating the substrate into a mobile device, or both.

24 . An apparatus, comprising:
a substrate having a land side; a capacitor mounted on the land side of the substrate and having an equivalent series resistance (ESR) and terminals; a means for providing a resistance, wherein the means for providing the resistance is coupled to the terminals and is configured to control the ESR; and a plurality of vias coupled to the means for providing the resistance.

25 . The apparatus of claim 24 , wherein the means for providing the resistance is formed of a resistive paste.

26 . The apparatus of claim 24 , wherein the means for providing the resistance is formed in a substantially semicircular shape having an arc ranging from substantially 45 degrees to substantially 135 degrees.

27 . The apparatus of claim 24 , wherein the means for providing the resistance is formed in a substantially semicircular shape that is substantially centered on an axis and varies in cross-section along a radius extending from the axis.

28 . The apparatus of claim 24 , wherein the means for providing the resistance has a substantially right-angle bend.

29 . The apparatus of claim 24 , wherein the means for providing the resistance is formed in a shape of a land-side capacitor mounting pad, a via, or both.

30 . The apparatus of claim 24 , further comprising a base station of which the substrate is a constituent part, a mobile device of which the substrate is a constituent part, or both.

Assignees

• Qualcomm Inc

Inventors

• Song Young Kyu
• Rouhana Layal
• Hwang Kyu-Pyung
• Bchir Omar James

Classifications

• H05K1/167

  incorporating printed resistors · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H05K3/3442

  having edge contacts, e.g. leadless chip capacitors, chip carriers · CPC title

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title