Embedded thin film magnetic carrier for integrated voltage regulator

Patent metadata

Field	Value
Publication number	US-10199152-B2
Application number	US-201514743623-A
Country	US
Kind code	B2
Filing date	Jun 18, 2015
Priority date	Dec 3, 2014
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.

First claim

What is claimed is:

1. An inductor, comprising:
a first substrate formed within a second package substrate;
a first magnetic piece connected to a first side of the first substrate;
a second magnetic piece connected to a second side of the first substrate, the second side opposite of the first side; and
a conductor formed at least one of within the second package substrate or on the second package substrate, with an input and an output, and configured to surround the first substrate without being in contact with the first substrate and without being in contact with the first magnetic piece or the second magnetic piece, wherein at least one first portion of the conductor is formed in at least one via of the second package substrate.

2. The inductor of claim 1 , wherein the first substrate is made of a material comprising a glass.

3. The inductor of claim 1 , wherein the first substrate is made of a dielectric material.

4. The inductor of claim 1 , wherein the first substrate is made of an organic material.

5. The inductor of claim 1 , wherein the first substrate is made of a first material and the second package substrate is made of a second material, the second material different from the first material.

6. The inductor of claim 1 , wherein the first substrate is made of a material having a root mean square profile roughness parameter that is less than or equal to 100 Angstroms.

7. The inductor of claim 1 , wherein the first magnetic piece is made of a material comprising at least one of cobalt tantalum zirconium, cobalt iron, or a nickel iron alloy.

8. The inductor of claim 1 , further comprising:
a dielectric piece connected to the first magnetic piece; and
a third magnetic piece connected to the dielectric piece.

9. The inductor of claim 1 , wherein the second magnetic piece is made of a material comprising at least one of cobalt tantalum zirconium, cobalt iron, or a nickel iron alloy.

10. The inductor of claim 1 , wherein at least one second portion of the conductor is formed as at least one conduction pad, the at least one conduction pad formed at a junction of a first layer of the second package substrate with a second layer of the second package substrate.

11. The inductor of claim 10 , wherein at least one third portion of the conductor is formed as at least one interconnect at least one of within the second package substrate or on the second package substrate.

12. An inductor, comprising:
means for supporting a magnet formed within a package substrate; and
means for conducting a current, the means for conducting the current configured to surround the means for supporting the magnet without being in contact with the means for supporting the magnet and without being in contact with the magnet wherein at least one first portion of the means for conducting is formed in at least one via of the package substrate.

Assignees

• Qualcomm Inc

Inventors

• Erturk Mete
• Shenoy Ravindra Vaman
• Lai Kwan-Yu
• Kim Jitae
• Kidwell Jr Donald William
• Lasiter Jon Bradley
• Doyle James Thomas
• Bchir Omar James

Classifications

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H05K1/165

  incorporating printed inductors · CPC title

• H01F2017/0066

  with a magnetic layer · CPC title

• H01F2017/002

  Details of via holes for interconnecting the layers · CPC title

• H01F41/046

  structurally combined with ferromagnetic material · CPC title