A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
by plating
by plating · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/384 |
| Official title | {by plating} |
| Display label | by plating |
| Total patents | 190 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 18 |
| 2016 | 14 |
| 2017 | 15 |
| 2018 | 16 |
| 2019 | 14 |
| 2020 | 18 |
| 2021 | 17 |
| 2022 | 20 |
| 2023 | 17 |
| 2024 | 15 |
| 2025 | 22 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
High-speed interconnects for printed circuit boards
US-2018332720-A1 · Nov 15, 2018 · US
Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device
US-10123433-B2 · Nov 6, 2018 · US
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, And Method For Manufacturing Electronic Device
US-2018288881-A1 · Oct 4, 2018 · US
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, Heat Dissipation Substrate, And Method For Manufacturing Electronic Device
US-2018288884-A1 · Oct 4, 2018 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-2018279482-A1 · Sep 27, 2018 · US
Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board
US-2018264783-A1 · Sep 20, 2018 · US
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
US-10076032-B2 · Sep 11, 2018 · US
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device
US-2018160529-A1 · Jun 7, 2018 · US
Resin composite electrolytic copper foil, copper clad laminate and printed wiring board
US-9949371-B2 · Apr 17, 2018 · US
Method of manufacturing the printed board
US-2018098434-A1 · Apr 5, 2018 · US
Carrier base material-added wiring substrate
US-2018090426-A1 · Mar 29, 2018 · US
Method of manufacturing a multilayer flexible printed circuit board
US-9883584-B2 · Jan 30, 2018 · US
Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device
US-2017303405-A1 · Oct 19, 2017 · US
Manufacturing method of substrate structure, substrate structure and metal component
US-9790609-B2 · Oct 17, 2017 · US
Copper foil with carrier
US-9788423-B2 · Oct 10, 2017 · US
Multilayer flexible printed circuit board and method of manufacturing the same
US-2017280554-A1 · Sep 28, 2017 · US
Production method and device of surface roughened copper plate, and surface roughened copper plate
US-9758890-B2 · Sep 12, 2017 · US
Laminate For Printed Wiring Board, Method Of Manufacturing Printed Wiring Board, And Method Of Manufacturing Electronic Device
US-2017231101-A1 · Aug 10, 2017 · US
Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate
US-9730332-B2 · Aug 8, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/384?
- CPC H05K3/384 is the Cooperative Patent Classification code for “by plating.”
- How many patents are filed under CPC H05K3/384 (by plating)?
- Our database includes 190 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/384 growing?
- Publication counts under this code: 15 in 2024 vs 22 in 2025 (latest complete years).