Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

Patent metadata

Field	Value
Publication number	US-10076032-B2
Application number	US-201515127165-A
Country	US
Kind code	B2
Filing date	Mar 19, 2015
Priority date	Mar 20, 2014
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

A substrate for a printed circuit board includes a base film having an insulating property; a first conductive layer formed on at least one of surfaces of the base film by application of a conductive ink containing metal particles; and a second conductive layer formed, by plating, on a surface of the first conductive layer, the surface being on a side opposite to the base film, wherein a region near an interface between the base film and the first conductive layer contains a metal oxide species based on a metal of the metal particles and a metal hydroxide species based on the metal of the metal particles, the metal oxide species in the region near the interface between the base film and the first conductive layer has a mass per unit area of 0.1 μg/cm 2 or more and 10 μg/cm 2 or less, and a mass ratio of the metal oxide species to the metal hydroxide species is 0.1 or more.

First claim

The invention claimed is:

1. A substrate for a printed circuit board, comprising:
a base film having an insulating property;
a first conductive layer formed on at least one of surfaces of the base film by application of a conductive ink containing metal particles; and
a second conductive layer formed, by plating, on a surface of the first conductive layer, the surface being on a side opposite to the base film,
wherein a region near an interface between the base film and the first conductive layer contains a metal oxide species based on a metal of the metal particles and a metal hydroxide species based on the metal of the metal particles,
the metal oxide species in the region near the interface between the base film and the first conductive layer has a mass per unit area of 0.1 μg/cm 2 or more and 10 μg/cm 2 or less, and a mass ratio of the metal oxide species to the metal hydroxide species is 0.1 or more.

2. The substrate for a printed circuit board according to claim 1 , wherein the metal particles have a mean particle size of 1 nm or more and 500 nm or less.

3. The substrate for a printed circuit board according to claim 1 , wherein gaps in the first conductive layer are filled with the second conductive layer.

4. The substrate for a printed circuit board according to claim 1 , wherein the surface of the base film on which the first conductive layer is formed is subjected to a hydrophilic treatment.

5. The substrate for a printed circuit board according to claim 1 , wherein the first conductive layer is formed by heat-treating the applied conductive ink.

6. The substrate for a printed circuit board according to claim 1 , wherein the metal is copper.

7. The substrate for a printed circuit board according to claim 1 , wherein the metal particles are obtained by a liquid-phase reduction method of reducing metal ions with a reducing agent in an aqueous solution.

8. The substrate for a printed circuit board according to claim 7 , wherein the liquid-phase reduction method is a titanium redox process.

9. A printed circuit board comprising a conductive pattern,
wherein the conductive pattern is formed by performing a subtractive method or a semi-additive method on the first conductive layer and the second conductive layer of the substrate for a printed circuit board according to claim 1 .

Assignees

• Sumitomo Electric Industries
• Sumitomo Electric Printed Circuits Inc

Inventors

• Kasuga Takashi
• Oka Yoshio
• Nakayama Shigeyoshi
• Park Jinjoo
• Uehara Sumito
• Miura Kousuke
• Ueda Hiroshi

Classifications

• H05K1/05

  Insulated {conductive substrates, e.g. insulated} metal substrate · CPC title

• H05K1/092 Primary

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• H05K3/108

  by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241) · CPC title

• H05K3/384

  by plating · CPC title

• H05K3/022 Primary

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title