Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate

Patent metadata

Field	Value
Publication number	US-9730332-B2
Application number	US-201314342288-A
Country	US
Kind code	B2
Filing date	Nov 11, 2013
Priority date	Nov 9, 2012
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated copper foil to be laminated on a polyimide having the following ΔB (PI) of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising a surface having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the polyimide and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide laminated from the surface treated surface side with a CCD camera for the respective observation spots along the perpendicular direction of the extending direction of the observed copper foil.

First claim

The invention claimed is:

1. A surface treated copper foil to be laminated on a polyimide having a ΔB (PI) to be defined as follows of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising:
a surface having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the polyimide when the copper foil is laminated on the polyimide; and
a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more;
wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide when the copper foil is laminated on the polyimide from the surface treated surface side of the copper foil with a CCD camera for the respective observation spots along the direction perpendicular to the extending direction of the observed copper foil.

2. A surface treated copper foil to be laminated on a polyimide having a ΔB (PI) to be defined as follows of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising:
a surface having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the polyimide when the copper foil is laminated on the polyimide; and
an Sv defined by the following expression (1) of 3.0 or more based on a brightness curve:
Sv =(Δ B× 0.1)/( t 1− t 2)  (1);

wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide when the copper foil is laminated on the polyimide from the surface treated surface side of the copper foil with a CCD camera for the respective observation spots along the direction perpendicular to the extending direction of the observed copper foil, and the difference between the top average Bt and the bottom average Bb in the brightness curve extending from an edge of the copper foil to a portion without the copper foil is represented by AB (ΔB=Bt−Bb); and
wherein t1 represents a value pointing the position of the intersection closest to the copper foil among the intersections of the brightness curve and Bt in the observation spot versus brightness graph, and t2 represents a value pointing the position of the intersection closest to the copper foil among the intersections of the brightness curve and 0.1ΔB in the range from the intersections of the brightness curve and Bt to a depth of 0.1ΔB with Bt as reference.

3. The surface treated copper foil according to claim 1 , further comprising:
an Sv defined by the following expression (1) of 3.0 or more:
Sv =(Δ B× 0.1)/( t 1− t 2)  (1);

wherein t1 represents a value pointing the position of the intersection closest to the copper foil among the intersections of the brightness curve and Bt in the observation spot versus brightness graph, and t2 represents a value pointing the position of the intersection closest to the copper foil among the intersections of the brightness curve and 0.1ΔB in the range from the intersections of the brightness curve and Bt to a depth of 0.1ΔB with Bt as reference.

4. The surface treated copper foil to be laminated on a polyimide having a ΔB (PI) to be defined as follows of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate according to claim 1 , wherein the surface has a color difference ΔE*ab of 53 or more based on JIS Z 8730 through the polyimide.

5. The surface treated copper foil according to claim 2 , wherein the Sv defined by the expression (1) in the brightness curve is 3.5 or more.

6. The surface treated copper foil according to claim 1 , wherein the surface has a TD average roughness Rz of 0.20 to 0.64 μm, and the copper foil surface has a three-dimensional surface area A to two-dimensional surface area B ratio A/B of 1.0 to 1.7.

7. A laminate comprising the surface treated copper foil according to claim 1 and a resin substrate.

8. A printed wiring board comprising the surface treated copper foil according to claim 1 .

9. An electronic apparatus comprising at least one of the printed wiring board according to claim 8 .

10. A printed wiring board including an insulating resin substrate and a copper circuit arranged on the insulating resin substrate comprising:
a surface of the copper circuit having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the insulating resin substrate; and
a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of the copper circuit to a portion without the copper circuit ΔB (ΔB=Bt−Bb) of 40 or more;
wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper circuit through the insulating resin substrate with a CCD camera for the respective observation spots along the direction perpendicular to the extending direction of the observed copper circuit.

11. A copper clad laminate including an insulating resin substrate and a copper foil arranged on the insulating resin substrate comprising:
a surface of the copper foil having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the insulating resin substrate; and
a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of a linear copper foil to a portion without the linear copper foil ΔB (ΔB=Bt−Bb) of 40 or more;
wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil of the copper clad laminate after being etched into the linear copper foil through the insulating resin substrate with a CCD camera for the respective observation spots along the direction perpendicular to the extending direction of the observed linear copper foil.

12. A printed wiring board including an insulating resin substrate and a copper circuit arranged on the insulating resin substrate comprising:
a surface of the copper circuit having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the insulating resin substrate; and
an Sv defined by the following expression (1) of 3.0 or more based on a brightness curve:
Sv =(Δ B× 0.1)/( t 1− t 2)  (1);

wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper circuit through the insulating resin substrate with a CCD camera for the respective observation spots along the direction perpendicular to the extending direction of the observed copper circuit, and the difference between the top average Bt and the bottom average Bb in the brightness curve extending from an edge of the copper circuit to a portion without the copper circuit is represented by AB (ΔB=Bt−Bb); and
wherein t1 represents a value pointing the position of the intersection closest to the copper circuit among the intersections of the brightness curve and Bt in the observation spot versus brightness graph, and t2 represents a value pointing the position of the intersection closest to the copper circuit among the intersections of the brightness curve and 0.1ΔB in the range from the intersections of the brightness curve and Bt to a depth of 0.1ΔB with Bt as reference.

13. A copper clad laminate including an insulating resin substrate

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Arai Hideta
• Miki Atsushi
• Arai Kohsuke
• Nakamuro Kaichiro

Classifications

• C25D1/04 Primary

  Wires; Strips; Foils · CPC title

• H05K1/14

  Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) · CPC title

• Y10T428/31681

  Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.] · CPC title

• H05K2201/0154

  Polyimide · CPC title

• H05K2201/058

  Direct connection between two or more FPCs or between flexible parts of rigid PCBs · CPC title