Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device

Patent metadata

Field	Value
Publication number	US-2017303405-A1
Application number	US-201715486899-A
Country	US
Kind code	A1
Filing date	Apr 13, 2017
Priority date	Apr 15, 2016
Publication date	Oct 19, 2017
Grant date	—

Abstract

To provide a copper foil that the transmission loss is favorably controlled even when the copper foil is used in a high-frequency circuit board and that adhesion to a resin is favorable.
A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.

First claim

1 . A copper foil, comprising a roughened layer,
wherein the roughened layer includes a primary particle layer, wherein a surface roughness Ra of a surface on a side of the primary particle layer is 0.12 μm or less, and wherein an average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.

2 . The copper foil according to claim 1 ,
wherein the roughened layer includes a secondary particle layer on or over the primary particle layer, and an average particle size of secondary particles of the secondary particle layer is 0.35 μm or less.

3 . The copper foil according to claim 1 ,
wherein an average particle size of primary particles of the primary particle layer satisfies one or both of conditions (A-1) and (A-2) below: (A-1) the average particle size is less than 0.25 μm; and (A-2) the average particle size is 0.244 μm or less.

4 . The copper foil according to claim 2 ,
wherein an average particle size of primary particles of the primary particle layer satisfies one or both of conditions (A-1) and (A-2) below: (A-1) the average particle size is less than 0.25 μm; and (A-2) the average particle size is 0.244 μm or less.

5 . The copper foil according to claim 1 ,
wherein the copper foil satisfies one or two or three of conditions (B-1) to (B-3) below: (B-1) a circuit is formed by attaching a resin with a dielectric constant being 2.4, a dielectric tangent being 0.001, and a thickness being 50 μm to a surface on a side of the roughened layer of the copper foil, by making the thickness of the copper foil be 18 μm, and by etching the copper foil so that a characteristic impedance of the circuit is 50Ω, and when transmission loss of the circuit is measured at a frequency of 60 GHz, the transmission loss is 8.4 db/10 cm or less; (B-2) a circuit is formed by attaching a resin with a dielectric constant being 2.9, a dielectric tangent being 0.002, and a thickness being 50 μm to a surface on a side of the roughened layer of the copper foil, by making the thickness of the copper foil be 18 μm, and by etching the copper foil so that a characteristic impedance of the circuit is 50Ω, and when transmission loss of the circuit is measured at a frequency of 60 GHz, the transmission loss is 8.4 db/10 cm or less; and (B-3) a circuit is formed by attaching a resin with a dielectric constant being 3.2, a dielectric tangent being 0.002, and a thickness being 50 μm to a surface on a side of the roughened layer of the copper foil, by making the thickness of the copper foil be 18 μm, and by etching the copper foil so that a characteristic impedance of the circuit is 50Ω, and when transmission loss of the circuit is measured at a frequency of 60 GHz, the transmission loss is 8.4 db/10 cm or less.

6 . The copper foil according to claim 1 ,
wherein the copper foil satisfies one or two or three of conditions (C-1) to (C-3) below: (C-1) a total content of Co and Ni in the roughened layer is 2000 μg/dm 2 or less; (C-2) a total content of Co in the roughened layer is 1000 μg/dm 2 or less; and (C-3) a total content of Ni in the roughened layer is 1000 μg/dm 2 or less.

7 . The copper foil according to claim 2 ,
wherein the copper foil satisfies one or two or three of conditions (C-1) to (C-3) below: (C-1) a total content of Co and Ni in the roughened layer is 2000 μg/dm 2 or less; (C-2) a total content of Co in the roughened layer is 1000 μg/dm 2 or less; and (C-3) a total content of Ni in the roughened layer is 1000 μg/dm 2 or less.

8 . The copper foil according to claim 3 ,
wherein the copper foil satisfies one or two or three of conditions (C-1) to (C-3) below: (C-1) a total content of Co and Ni in the roughened layer is 2000 μg/dm 2 or less; (C-2) a total content of Co in the roughened layer is 1000 μg/dm 2 or less; and (C-3) a total content of Ni in the roughened layer is 1000 μg/dm 2 or less.

9 . The copper foil according to claim 4 ,
wherein the copper foil satisfies one or two or three of conditions (C-i) to (C-3) below: (C-1) a total content of Co and Ni in the roughened layer is 2000 μg/dmor less; (C-2) a total content of Co in the roughened layer is 1000 μg/dm 2 or less; and (C-3) a total content of Ni in the roughened layer is 1000 μg/dm 2 or less.

10 . The copper foil according to claim 1 ,
wherein a surface roughness Rz of a surface on a side of the primary particle layer is 1.6 μm or less.

11 . The copper foil according to claim 1 ,
wherein the copper foil has at least one layer selected from a group of a heat-resistant layer, a rustproofing layer, a chromate treated layer, and a silane coupling-treated layer on a surface of the roughened layer.

12 . The copper foil according to claim 1 ,
wherein the copper foil satisfies one or both of conditions (D-1) and (D-2) below: (D-1) the copper foil has a resin layer on a surface on a side of the roughened layer of the copper foil; and (D-2) the copper foil has a resin layer on a surface on a side of the roughened layer of the copper foil and the resin layer is an adhesive resin and/or a resin in a semi-cured state.

13 . The copper foil according to claim 1 ,
wherein the copper foil is a copper foil for a high-frequency circuit.

14 . A carrier-attached copper foil, comprising
an intermediate layer and an ultra-thin copper layer in this order on one or both of surfaces of a carrier, wherein the ultra-thin copper layer is the copper foil according to claim 1 .

15 . A carrier-attached copper foil, comprising
an intermediate layer and an ultra-thin copper layer in this order on one or both of surfaces of a carrier, wherein the ultra-thin copper layer is the copper foil according to claim 12 .

16 . The carrier-attached copper foil according to claim 14 ,
wherein the carrier-attached copper foil is a carrier-attached copper foil for a high frequency circuit.

17 . A laminate comprising the copper foil according to claim 1 or a carrier-attached copper foil including an intermediate layer and an ultra-thin copper layer in this order on one or both of surfaces of a carrier, the ultra-thin copper layer being the copper foil according to claim 1 , or
a laminate comprising a resin and a carrier-attached copper foil including an intermediate layer and an ultra-thin copper layer in this order on one or both of surfaces of a carrier, the ultra-thin copper layer being the copper foil according to claim 1 , wherein a portion or entirety of an end face of the carrier-attached copper foil is covered with the resin, or
a laminate of one carrier-attached copper foil including an intermediate layer and an ultra-thin copper layer in this order on one or both of surfaces of a carrier, the ultra-thin copper layer being the copper foil according to claim 1 and another carrier-attached copper foil including an intermediate layer and an ultra-thin copper layer in this order on one or both of surfaces of a carrier, the ultra-thin copper layer being the copper foil according to claim 1 , wherein a side of the carrier or a side of the ultra-thin copper layer of said one carrier-attached copper foil is attached to a side of the carrier or a side of the ultra-thin copper layer of said another carrier-attached copper foil.

18 . A method of manufacturing a printed wiring board by using the copper foil according to claim 1 or a carrier-attached copper foil including an intermediate layer and an ultra-thin copper layer in this order on one or both of surfaces of a carrier, the ultra-thin copper layer being the copper foil accor

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Fukuchi Ryo

Classifications

• H05K1/0237 Primary

  High frequency adaptations (H05K1/0216 takes precedence) · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• B32B37/14

  characterised by the properties of the layers · CPC title

• B32B38/10

  Removing layers, or parts of layers, mechanically or chemically · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title