Manufacturing method of substrate structure, substrate structure and metal component

Patent metadata

Field	Value
Publication number	US-9790609-B2
Application number	US-201514719329-A
Country	US
Kind code	B2
Filing date	May 22, 2015
Priority date	Jul 14, 2014
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

A manufacturing method of a substrate structure including the following steps is provided. A chemical surface treatment is performed on a metal base such that a passivation layer is formed on a surface of the metal base. The metal base is assembled to a substrate. A metal pattern is formed on the substrate, wherein the metal pattern is separated from the metal base. A substrate structure and a metal component are also provided.

First claim

What is claimed is:

1. A manufacturing method of a substrate structure comprising:
submerging a metal nut in a thiol compound solution to perform a chemical surface treatment on the metal nut with thiol groups of the thiol compound solution to form a passivation layer chemically bonded to a surface of the metal nut, wherein the passivation layer having a thickness ranging from 0.1 nm to 5 nm completely encapsulates the metal nut;
physically screwing the metal nut that is encapsulated by the passivation layer into a substrate; and
forming a metal pattern on the substrate, wherein the metal pattern is separated from the metal nut and the passivation layer.

2. The manufacturing method according to claim 1 , wherein the step of forming the metal pattern on the substrate comprises electroless plating.

Assignees

• Wistron Neweb Corp

Inventors

• Chuang Tzu-Wen
• Radi Babak
• Chen Shih-Hong
• Chen Chun-Lin

Classifications

• C23C18/1605

  by masking · CPC title

• H05K3/384

  by plating · CPC title

• C25D5/34 Primary

  Pretreatment of metallic surfaces to be electroplated · CPC title

• H05K3/387

  for electroless plating (H05K3/4661 takes precedence) · CPC title

• H05K3/389

  by the use of a coupling agent, e.g. silane · CPC title