Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board

Patent metadata

Field	Value
Publication number	US-2018264783-A1
Application number	US-201615761274-A
Country	US
Kind code	A1
Filing date	Sep 23, 2016
Priority date	Sep 24, 2015
Publication date	Sep 20, 2018
Grant date	—

Abstract

Such a metal foil is provided that a release layer is provided on a metal foil to enable physical release of a resin substrate, to which the metal foil is adhered, and thereby in the step of removing the metal foil from the resin substrate, the metal foil can be removed with good cost without damaging the surface profile of the metal foil transferred to the surface of the resin substrate, and also resins having different resin components can be adhered with good adhesion. A metal foil containing, on at least one surface of the metal foil, surface unevenness having a root mean square height Sq of from 0.25 to 1.6 μm.

First claim

1 . A metal foil comprising, on at least one surface of the metal foil, surface unevenness having a root mean square height Sq of from 0.25 to 1.6 μm.

2 . A metal foil comprising, on at least one surface of the metal foil, surface unevenness having a ratio (Sq/Rsm) of a root mean square height Sq to an average interval Rsm of the roughness of from 0.05 to 0.40.

3 . The metal foil according to claim 1 , wherein the metal foil comprises, on at least one surface of the metal foil, surface unevenness having a ratio (Sq/Rsm) of a root mean square height Sq to an average interval Rsm of the roughness of from 0.05 to 0.40.

4 . The metal foil according to claim 1 , wherein the metal foil has a thickness of from 5 to 105 μm.

5 . The metal foil according to claim 1 , wherein the metal foil is a copper foil.

6 . The metal foil according to claim 1 , wherein the metal foil comprises, on a surface of the metal foil, one or more layer selected from the group consisting of a roughening treatment layer, a heat resistant layer, a rust preventing layer, a chromate treatment layer, and a silane coupling treatment layer.

7 . The metal foil according to claim 6 , wherein the metal foil comprises a resin layer on the one or more layer selected from the group consisting of a roughening treatment layer, a heat resistant layer, a rust preventing layer, a chromate treatment layer, and a silane coupling treatment layer.

8 . The metal foil according to claim 7 , wherein the resin layer is an adhesive resin, a primer, or a semi-cured resin.

9 . A metal foil having a release layer comprising
the metal foil according to claim 1 and a release layer provided on a side of the metal foil having the surface unevenness.

10 . The metal foil having a release layer according to claim 9 , wherein the release layer comprises one kind or a combination of plural kinds of an aluminate compound, a titanate compound, or a zirconate compound represented by the following formula, a hydrolyzed product of the aluminate compound, the titanate compound, or the zirconate compound, and a condensed product of the hydrolyzed product:
(R 1 ) m -M-(R 2 ) n
wherein R 1 represents an alkoxy group or a halogen atom; R 2 represents a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or the hydrocarbon group, in which one or more hydrogen atom is substituted by a halogen atom; M represents any one of Al, Ti, and Zr; n represents 0, 1, or 2; and m represents an integer of 1 or more and a valency of M or less, provided that at least one of R 1 is an alkoxy group, and m+n is a valency of M, which is 3 for Al or 4 for Ti and Zr.

11 . The metal foil having a release layer according to claim 9 , wherein the release layer comprises one kind or a combination of plural kinds of a silane compound represented by the following formula, a hydrolyzed product of the silane compound, and a condensed product of the hydrolyzed product:

wherein R 1 represents an alkoxy group or a halogen atom; R 2 represents a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or the hydrocarbon group, in which one or more hydrogen atom is substituted by a halogen atom; R 3 and R 4 each independently represent a halogen atom, an alkoxy group, a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or the hydrocarbon group, in which one or more hydrogen atom is substituted by a halogen atom.

12 . The metal foil having a release layer according to claim 9 , wherein the release layer comprises a compound containing two or less mercapto groups in a molecule.

13 . The metal foil having a release layer according to claim 9 , wherein the metal foil having a release layer comprises a resin layer provided on a surface of the release layer.

14 . The metal foil having a release layer according to claim 13 , wherein the resin layer is an adhesive resin, a primer, or a semi-cured resin.

15 . A laminated material comprising
the metal foil according to claim 1 , or a metal foil having a release layer comprising the metal foil according to claim 1 and a release layer provided on a side of the metal foil having the surface unevenness and a resin substrate provided on the metal foil or the metal foil having a release layer.

16 . The laminated material according to claim 15 , wherein the resin substrate is a prepreg or contains a thermosetting resin.

17 . A printed wiring board comprising the metal foil according to claim 1 or a metal foil having a release layer comprising the metal foil according to claim 1 and a release layer provided on a side of the metal foil having the surface unevenness.

18 . A semiconductor package comprising the printed wiring board according to claim 17 .

19 . An electronic device comprising the printed wiring board according to claim 17 .

20 . A method for producing a printed wiring board, comprising:
adhering a resin substrate to the metal foil according to claim 1 or a metal foil having a release layer comprising the metal foil according to claim 1 and a release layer provided on a side of the metal foil having the surface unevenness; releasing the metal foil or the metal foil having a release layer without etching, from the resin substrate, so as to provide a resin substrate having a surface profile transferred from a surface of the metal foil or the metal foil having a release layer to a released surface of the resin substrate; and forming a circuit on the released surface of the resin substrate having the surface profile transferred.

21 . The method for producing a printed wiring board according to claim 20 , wherein the circuit formed on the released surface of the resin substrate having the surface profile transferred is a plated pattern or a printed pattern.

22 . A method for producing a printed wiring board, comprising:
adhering a resin substrate to the metal foil according to claim 1 or a metal foil having a release layer comprising the metal foil according to claim 1 and a release layer provided on a side of the metal foil having the surface unevenness; releasing the metal foil or the metal foil having a release layer without etching, from the resin substrate, so as to provide a resin substrate having a surface profile transferred from a surface of the metal foil or the metal foil having a release layer to a released surface of the resin substrate; and providing a build-up layer on the released surface of the resin substrate having the surface profile transferred.

23 . The method for producing a printed wiring board according to claim 22 , wherein a resin constituting the build-up layer contains a liquid crystal polymer or polytetrafluoroethylene.

24 . A metal foil having a release layer comprising
the metal foil according to claim 2 and a release layer provided on a side of the metal foil having the surface unevenness.

25 . A metal foil having a release layer comprising
the metal foil according to claim 3 and a release layer provided on a side of the metal foil having the surface unevenness.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Moriyama Terumasa
• Ishii Masafumi

Classifications

• B32B2307/306

  Resistant to heat · CPC title

• B32B5/022

  Non-woven fabric · CPC title

• B32B2457/14

  Semiconductor wafers · CPC title

• B32B7/06

  permitting easy separation · CPC title

• B32B2260/046

  Synthetic resin · CPC title