Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device

Patent metadata

Field	Value
Publication number	US-2018160529-A1
Application number	US-201715827056-A
Country	US
Kind code	A1
Filing date	Nov 30, 2017
Priority date	Dec 5, 2016
Publication date	Jun 7, 2018
Grant date	—

Abstract

Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180° C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable.
Also disclosed is a surface treated copper foil, comprising a copper foil, and a surface treatment layer on one or both sides of the copper foil, wherein the surface treatment layer has a primary particle layer, or has a primary particle layer and s secondary particle layer in this order from the side of the copper foil; the surface treatment layer contains Zn, a deposition amount of Zn in the surface treatment layer is 150 μg/dm 2 or more; the surface treatment layer does not contain Ni, or in the case where the surface treatment layer contains Ni, a deposition amount of Ni in the surface treatment layer is 800 μg/dm 2 or less; the surface treatment layer does not contain Co, or in the case where the surface treatment layer contains Co, a deposition amount of Co in the surface treatment layer is 3000 μg/dm 2 or less; and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 μm or less.

First claim

1 . A surface treated copper foil, comprising
a copper foil, and
a surface treatment layer on at least one surface of the copper foil,
wherein the surface treatment layer has a primary particle layer, or the surface treatment layer has a primary particle layer and a secondary particle layer, a deposition amount of Zn in the surface treat layer is 150 μg/dm 2 or more, the surface treatment layer does not contain Ni, or a deposition amount of Ni in the surface treatment layer is 800 μg/dm 2 or less, the surface treatment layer does not contain Co, or a deposition amount of Co in the surface treatment layer is 3000 μg/dm 2 or less, and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 μm or less.

2 . A surface treated copper foil, comprising
a copper foil, and
a surface treatment layer on at least one surface of the copper foil,
wherein the surface treatment layer has a primary particle layer, or the surface treatment layer has a primary particle layer and a secondary particle layer, the surface treatment layer contains Zn and Mo, a sum of deposition amount of Zn and Mo in the surface treatment layer is 200 μg/dm 2 or more, the surface treatment layer does not contain Ni, or a deposition amount of Ni in the surface treatment layer is 800 μg/dm 2 or less, the surface treatment layer does not contain Co, or a deposition amount of Co in the surface treatment layer is 3000 μg/dm 2 or less, and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 μm or less.

3 . The surface treated copper foil according to claim 1 , wherein the deposition amount of Zn in the surface treatment layer is 200 μg/dm 2 or more.

4 . The surface treated copper foil according to claim 1 , wherein the deposition amount of Zn in the surface treatment layer is 250 μg/dm 2 or more.

5 . The surface treated copper foil according to claim 1 , wherein the deposition amount of Ni in the surface treatment layer is 750 μg/dm 2 or less.

6 . The surface treated copper foil according to claim 2 , wherein the deposition amount of Ni in the surface treatment layer is 750 μg/dm 2 or less.

7 . The surface treated copper foil according to claim 1 , wherein the deposition amount of Co in the surface treatment layer is 2790 μg/dm 2 or less.

8 . The surface treated copper foil according to claim 2 , wherein the deposition amount of Co in the surface treatment layer is 2790 μg/dm 2 or less.

9 . The surface treated copper foil according to claim 1 , wherein the ten point average roughness Rz of the outermost surface of the surface treatment layer is 1.0 μm or less.

10 . The surface treated copper foil according to claim 2 , wherein the sum of deposition amount of Zn and Mo in the surface treatment layer is 340 μg/dm 2 or more.

11 . The surface treated copper foil according to claim 1 , wherein the surface treatment layer contains Co and Ni, and a sum of deposition amount of Co and Ni in the surface treatment layer is 3500 μg/dm 2 or less.

12 . The surface treated copper foil according to claim 1 ,
wherein after laminating the surface treated copper foil, from the side of the surface treatment layer, with a resin, etching the surface treated copper foil and forming a copper wiring having a width of 10 mm, a peel strength at the time of peeling off the copper wiring from the resin in a 90° direction is 0.5 kg/cm or more, and the resin and conditions for the lamination are any one, two, or three of the following (1) to (3): (1) The resin: liquid crystal polymer resin that is a copolymer of hydroxybenzoic acid and hydroxynaphthoic acid, thickness of 50 μm, and The conditions for the lamination: pressure 3.5 MPa, heating temperature 300° C., heating time 10 minutes; (2) The resin: low dielectric polyimide resin, thickness 50 μm, and The conditions for the lamination: pressure 4 MPa, heating temperature 360° C., heating time 5 minutes; (3) The resin: polytetrafluoroethylene, thickness 50 μm, and The conditions for the lamination: pressure 5 MPa, heating temperature 350° C., heating time 30 minutes.

13 . The surface treated copper foil according to claim 12 wherein the peel strength is 0.7 kg/cm or more.

14 . The surface treated copper foil according to claim 1 ,
wherein after laminating the surface treated copper foil, from the side of the surface treatment layer, with a resin, etching the surface treated copper foil, forming a copper wiring having a width of 10 mm, and heating the copper wiring under the atmosphere at 180° C. for 10 days, a peel strength at the time of peeling off the copper wiring from the resin in a 90° direction is 0.4 kg/cm or more, and the resin and conditions for the lamination are any one, two, or three of the following (1) to (3): (1) The resin: liquid crystal polymer resin that is a copolymer of hydroxybenzoic acid and hydroxynaphthoic acid, thickness of 50 μm, and The conditions for the lamination: pressure 3.5 MPa, heating temperature 300° C., heating time 10 minutes; (2) The resin: low dielectric polyimide resin, thickness 50 μm, and The conditions for the lamination: pressure 4 MPa, heating temperature 360° C., heating time 5 minutes; (3) The resin: polytetrafluoroethylene, thickness 50 μm, and The conditions for the lamination: pressure 5 MPa, heating temperature 350° C., heating time 30 minutes.

15 . The surface treated copper foil according to claim 14 , wherein after laminating the surface treated copper foil, from the side of the surface treatment layer, with the resin, etching the surface treated copper foil, forming the copper wiring having the width of 10 mm, and heating the copper wiring under the atmosphere at 180° C. for 10 days, the peel strength at the time of peeling off the copper wiring from the resin in the 90° direction is 0.5 kg/cm or more.

16 . The surface treated copper foil according to claim 1 , satisfying any one of the following (16-1) to (16-4):
(16-1) The surface treatment layer has either one or both of the following (A) and (B) on or over the primary particle layer or on or over the secondary particle layer:
(A) An alloy layer comprising Ni, and one or more elements selected from the group consisting of Fe, Cr, Mo, Zn, Ta, Cu, Al, P, W, Mn, Sn, As and Ti
(B) A chromate treatment layer;
(16-2) The surface treatment layer has at least one of the following (A) and (B) on or over the primary particle layer or on or over the secondary particle layer, and the surface treatment layer has the following (C) on or over the primary particle layer or on or over the secondary particle layer:
(A) An alloy layer comprising Ni, and one or more elements selected from the group consisting of Fe, Cr, Mo, Zn, Ta, Cu, Al, P, W, Mn, Sn, As and Ti
(B) A chromate treatment layer
(C) a silane coupling treatment layer;
(16-3) The surface treatment layer has at least one of a Ni—Zn alloy layer and a chromate treatment layer, on or over the primary particle layer or on or over the secondary particle layer; (16-4) The surface treatment layer has at least one of a Ni—Zn alloy layer and a chromate treatment layer on or over the primary particle layer or on or over the secondary particle layer, and the surface treatment layer has a silane coupling treatment layer, on or over the primary particle layer or on or over the secondary particle layer.

17 . The surface treated copper foil according to claim 1 , wherein the surface treated copper foil is for the use of a high frequency circuit substrate.

18 . A surface trea

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Arai Hideta
• Fukuchi Ryo
• Miki Atsushi

Classifications

• H05K3/06

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• H05K1/09 Primary

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K3/007

  Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence) · CPC title

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title

• H05K3/384

  by plating · CPC title