Resin composite electrolytic copper foil, copper clad laminate and printed wiring board

Patent metadata

Field	Value
Publication number	US-9949371-B2
Application number	US-201615241749-A
Country	US
Kind code	B2
Filing date	Aug 19, 2016
Priority date	Jul 24, 2009
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 pm to 3.0 pm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.

First claim

What is claimed is:

1. A resin composite electrolytic copper foil prepared by forming a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 μm to 3.0 μm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and forming a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure wherein imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface,
wherein a measurement method of the lightness value is a method of irradiating a measurement sample surface and measuring a light reflection amount to be represented as a lightness value,
wherein the plurality of minute projections include minute projections comprising a plurality of bored portions, and the minute projections are located by 200 to 25000 in an area of 100 μm×100 μm,
the roughened surface includes pores having a pore diameter of 100 to 1000 nm, and the volume of pores with a pore diameter of 100 to 1000 nm is not less than 0.1 mL/m 2 when measured with a Shimadzu Autopore III 9400 series apparatus,
the block copolymerized polyimide resin (a) is a block copolymerized polyimide resin (a) having a block of the general formula (1) as a structural unit and a block of the general formula (2) as a structural unit,

in the formulae, m and n are each not less than 2, and m:n=1:9 to 3:1, and
the resin composition (B) contains an inorganic filler (b).

2. A resin composite electrolytic copper foil according to claim 1 , wherein the weight average molecular weights of the first and the second structural units in the block copolymerized polyimide resin (a) are each independently 5000 to 30000.

3. A resin composite electrolytic copper foil according to claim 1 , wherein the resin composition (B) contains the inorganic filler (b) within a range of 5 to 50% by volume based on total 100% by volume of the block copolymerized polyimide resin (a) and the inorganic filler (b).

4. A resin composite electrolytic copper foil according to claim 1 , wherein the resin composition (B) contains a maleimide compound (c).

5. A resin composite electrolytic copper foil according to claim 4 , wherein in the resin composition (B), the content of the block copolymerized polyimide resin (a) and the maleimide compound (c) is 1:9 to 9:1 in the weight ratio.

6. A resin composite electrolytic copper foil according to claim 4 , wherein the maleimide compound (c) is 2,2-bis[4-(4-maleimidephenoxy)phenyl]propane.

7. A resin composite electrolytic copper foil according to claim 1 , wherein the thickness of the layer of the resin composition (B) is 1 μm to 10 μm.

8. A copper clad laminate prepared by layer laminating a resin composite electrolytic copper foil according to claim 1 and a B-stage resin composition.

9. A copper clad laminate according to claim 8 , wherein the B-stage resin composition layer contains a resin and an inorganic filler, and contains the inorganic filler within a range of 5 to 50% by volume based on total 100% by volume of the resin and the inorganic filler.

10. A copper clad laminate prepared by forming a copper layer with plating on a surface of a copper clad laminate according to claim 8 where copper is entirely removed.

11. A printed wiring board using a copper clad laminate according to claim 8 .

12. A copper clad laminate prepared by layer laminating a resin composite electrolytic copper foil according to claim 2 and a B-stage resin composition.

13. A copper clad laminate prepared by layer laminating a resin composite electrolytic copper foil according to claim 3 and a B-stage resin composition.

14. A copper clad laminate prepared by layer laminating a resin composite electrolytic copper foil according to claim 4 and a B-stage resin composition.

15. A copper clad laminate prepared by layer laminating a resin composite electrolytic copper foil according to claim 5 and a B-stage resin composition.

16. A copper clad laminate prepared by layer laminating a resin composite electrolytic copper foil according to claim 6 and a B-stage resin composition.

17. A copper clad laminate prepared by layer laminating a resin composite electrolytic copper foil according to claim 7 and a B-stage resin composition.

18. A copper clad laminate according to claim 12 , wherein the B-stage resin composition layer contains a resin and an inorganic filler, and contains the inorganic filler within a range of 5 to 50% by volume based on total 100% by volume of the resin and the inorganic filler.

19. A copper clad laminate according to claim 13 , wherein the B-stage resin composition layer contains a resin and an inorganic filler, and contains the inorganic filler within a range of 5 to 50% by volume based on total 100% by volume of the resin and the inorganic filler.

20. A copper clad laminate according to claim 14 , wherein the B-stage resin composition layer contains a resin and an inorganic filler, and contains the inorganic filler within a range of 5 to 50% by volume based on total 100% by volume of the resin and the inorganic filler.

Assignees

• Mitsubishi Gas Chemical Co
• Pi R&D Co Ltd

Inventors

• Nozaki Mitsuru
• Nomoto Akihiro
• Akiyama Norikatsu
• Nagata Eiji
• Yano Masashi

Classifications

• H05K1/0346

  containing N · CPC title

• H05K3/384

  by plating · CPC title

• H05K2201/0358

  Resin coated copper [RCC] · CPC title

• H05K1/09 Primary

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• C25D5/022

  using masking means · CPC title