Substrate processing method and substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-2022251709-A1
Application number	US-202017596385-A
Country	US
Kind code	A1
Filing date	Jun 4, 2020
Priority date	Jun 17, 2019
Publication date	Aug 11, 2022
Grant date	—

Abstract

A substrate processing method includes activating, accumulating, forming a plating film, performing a post-processing and drying. In the activating, a plating liquid L1 is activated by heating and maintaining the plating liquid at a preset temperature. In the accumulating, the activated plating liquid is accumulated on a substrate W. In the forming of the plating film, the plating film is formed on the substrate by electroless plating while heating the substrate on which the plating liquid is accumulated. In the performing of the post-processing, the post-processing is performed on the substrate on which the plating film is formed. In the drying, the substrate after being subjected to the post-processing is dried. Activating the plating liquid for the substrate to be processed next is performed in parallel with the forming of the plating film, the performing of the post-processing, and the drying upon the substrate being processed currently.

First claim

1 . A substrate processing method, comprising:
activating a plating liquid by previously heating and maintaining the plating liquid at a preset temperature; accumulating the activated plating liquid on a substrate; forming a plating film on the substrate by electroless plating while heating the substrate on which the plating liquid is accumulated; performing a post-processing with a liquid on the substrate on which the plating film is formed; and drying the substrate after being subjected to the post-processing, wherein activating the plating liquid for the substrate to be processed next is performed in parallel with the forming of the plating film, the performing of the post-processing, and the drying of the substrate upon the substrate being processed currently.

2 . The substrate processing method of claim 1 , further comprising:
receiving a designation of a required time of the activating of the plating liquid; and delaying a start of the accumulating of the activated plating liquid on the substrate to be processed next, based on the required time in the receiving of the designation of the required time and a time taken for the forming of the plating film, the performing of the post-processing and the drying of the substrate.

3 . The substrate processing method of claim 2 , further comprising:
performing a pre-processing with a liquid on the substrate before being subjected to the accumulating of the plating liquid, wherein in the delaying of the start, the start of the accumulating of the plating liquid on the substrate to be processed next is delayed by as much as a time calculated by subtracting the time taken for the forming of the plating film, the performing of the post-processing and the drying of the substrate and a time taken for the performing of the pre-processing from the required time in the receiving of the designation of the required time.

4 . The substrate processing method of claim 2 , further comprising:
delaying, when processing a first one of multiple substrates to be successively processed, the start of the accumulating of the plating liquid by a time equivalent to the time taken for the forming of the plating film, the performing of the post-processing and the drying of the substrate.

5 . A substrate processing apparatus, comprising:
an activation unit configured to activate a plating liquid by previously heating and maintaining the plating liquid at a preset temperature; a holder configured to hold and rotate a substrate; a first liquid supply configured to supply the plating liquid activated by the activation unit to the substrate held by the holder; a heating unit configured to heat the substrate held by the holder; a second liquid supply configured to supply a processing liquid other than the plating liquid to the substrate held by the holder; and a controller configured to control the activation unit to perform an activation processing of activating the plating liquid, control the first liquid supply to perform a liquid accumulation processing of accumulating the plating liquid activated by the activation unit on the substrate, control the heating unit to perform a plating processing of forming a plating film on the substrate by electroless plating while heating the substrate on which the plating liquid is accumulated, control the second liquid supply to perform a post-processing of liquid-processing the substrate after being subjected to the plating processing, and control the holder to perform a drying processing of drying the substrate after being subjected to the post-processing, wherein the controller performs the activation processing of activating the plating liquid for the substrate to be processed next in parallel with the plating processing, the post-processing and the drying processing on the substrate being processed currently.

Assignees

• Tokyo Electron Ltd

Inventors

• Niwa Takafumi

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• C23C18/31

  Coating with metals · CPC title

• C23C18/1676

  Heating of the solution · CPC title

• C23C18/1632

  Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells · CPC title

• C23C18/1628 Primary

  Specific elements or parts of the apparatus · CPC title