Substrate processing apparatus, substrate processing method and recording medium

Patent metadata

Field	Value
Publication number	US-2022145468-A1
Application number	US-202017434160-A
Country	US
Kind code	A1
Filing date	Feb 14, 2020
Priority date	Feb 28, 2019
Publication date	May 12, 2022
Grant date	—

Abstract

A controller performs an adjustment processing including: forming a film on a surface of a substrate by a film forming unit; removing a peripheral portion of the film by the film forming unit; acquiring surface information indicating a state of the surface of the substrate including the film, from which the peripheral portion has been removed, by a surface inspection unit and adjusting a cut width of the peripheral portion based on the surface information; and peeling the film, from which the peripheral portion has been removed, by the film forming unit, and a process processing including: forming the film on the surface of the substrate by the film forming unit; and removing the peripheral portion by the cut width adjusted in the adjustment processing in the film forming unit.

First claim

1 . A substrate processing apparatus, comprising:
a film forming unit configured to form a film on a surface of a substrate and remove at least a part of the film; a surface inspection unit configured to acquire surface information indicating a state of the surface of the substrate; and a controller configured to control the film forming unit and the surface inspection unit, wherein the controller performs: an adjustment processing including: forming the film on the surface of the substrate by the film forming unit; removing a peripheral portion of the film by the film forming unit; acquiring the surface information indicating the state of the surface of the substrate including the film, from which the peripheral portion has been removed, by the surface inspection unit and adjusting a cut width of the peripheral portion based on the surface information; and peeling the film, from which the peripheral portion has been removed, by the film forming unit; and a process processing including: forming the film on the surface of the substrate by the film forming unit; and removing the peripheral portion by the cut width adjusted in the adjustment processing in the film forming unit.

2 . The substrate processing apparatus of claim 1 ,
wherein the controller repeatedly performs the adjustment processing until a deviation between the cut width and a target value reaches a predetermined level.

3 . The substrate processing apparatus of claim 2 ,
wherein the controller repeatedly performs the adjustment processing using a same substrate.

4 . The substrate processing apparatus of claim 1 , further comprising:
a transfer unit configured to transfer the substrate, wherein, in the adjustment processing, the controller further performs: carrying the substrate for the adjustment processing out of an accommodation unit that accommodates therein the substrate, on which the film has not been formed, by the transfer unit; and carrying the substrate, from which the film has been removed, into the accommodation unit by the transfer unit.

5 . The substrate processing apparatus of claim 1 , further comprising:
a rotation holder configured to hold and rotate the substrate, wherein the film forming unit has a nozzle configured to discharge a chemical liquid for removing the peripheral portion toward the substrate being rotated by the rotation holder, and the controller adjusts, in the adjustment processing, the cut width by adjusting at least one of a holding position of the substrate on the rotation holder or a position of the nozzle when the chemical liquid is discharged.

6 . The substrate processing apparatus of claim 1 ,
wherein the controller further performs acquiring the surface information indicating the state of the surface of the substrate, on which the film has not been formed, by the surface inspection unit and determining whether the substrate is allowed to be used in adjusting the cut width based on the surface information.

7 . The substrate processing apparatus of claim 1 ,
wherein the film forming unit has multiple processing units each configured to form the film and remove at least the part of the film, and while performing the process processing in any one of the multiple processing units, the controller performs at least a part of the adjustment processing in another processing unit of the multiple processing units.

8 . The substrate processing apparatus of claim 1 ,
wherein the film forming unit has multiple processing units each configured to form the film and removes at least the part of the film, and while performing the adjustment processing in any one of the multiple processing units, the controller performs the adjustment processing in another processing unit of the multiple processing units.

9 . The substrate processing apparatus of claim 1 ,
wherein the film forming unit has a first processing unit configured to form the film and remove the peripheral portion and a second processing unit configured to peel the film, and in the adjustment processing of adjusting the cut width in the first processing unit, the controller peels the film, from which the peripheral portion has been removed, by the second processing unit.

10 . A substrate processing method, comprising:
performing an adjustment processing including: forming a film on a surface of a substrate by a film forming unit configured to form the film on the surface of the substrate and remove at least a part of the film; removing a peripheral portion of the film by the film forming unit; adjusting a cut width of the peripheral portion based on surface information indicating a state of the surface of the substrate including the film, from which the peripheral portion has been removed; and peeling the film, from which the peripheral portion has been removed, by the film forming unit; and performing a process processing including: forming the film on the surface of the substrate by the film forming unit; and removing the peripheral portion by the cut width adjusted in the adjustment processing in the film forming unit.

11 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause an apparatus to perform a substrate processing method as claimed in claim 10 .

Assignees

• Tokyo Electron Ltd

Inventors

• SHIRASAKA Tetsuro
• Nakamura Naoto

Classifications

• H10P72/0604 Primary

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0448 Primary

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/7604

  the wafers being placed on a susceptor, stage or support · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P76/204

  of organic photoresist masks · CPC title