Substrate processing apparatus and substrate processing method

Patent metadata

Field	Value
Publication number	US-2022154342-A1
Application number	US-202017598597-A
Country	US
Kind code	A1
Filing date	Mar 24, 2020
Priority date	Mar 28, 2019
Publication date	May 19, 2022
Grant date	—

Abstract

A substrate processing apparatus includes a liquid processing module, provided with a carry-out/in opening of a substrate, including therein a first liquid processing device and a second liquid processing device; a module-outside transfer device configured to carry the substrate out from and into the liquid processing module; and a module-inside transfer device configured to transfer the substrate between the first liquid processing device and the second liquid processing device. The first liquid processing device is equipped with a first holder configured to hold the substrate. The second liquid processing device is equipped with a second holder configured to hold the substrate. The second liquid processing device is configured to perform a plating processing on the substrate held by the second holder. The first liquid processing device is configured to perform at least a post-cleaning processing performed after the plating processing on the substrate held by the first holder.

First claim

1 . A substrate processing apparatus, comprising:
a liquid processing module, provided with a carry-out/in opening of a substrate, including therein a first liquid processing device and a second liquid processing device provided at a position farther from the carry-out/in opening than the first liquid processing device; a module-outside transfer device configured to carry the substrate out from and into the liquid processing module; and a module-inside transfer device configured to transfer the substrate between the first liquid processing device and the second liquid processing device, wherein the first liquid processing device is equipped with a first holder configured to hold the substrate, the second liquid processing device is equipped with a second holder configured to hold the substrate, the second liquid processing device is configured to perform a plating processing on the substrate held by the second holder, and the first liquid processing device is configured to perform at least a post-cleaning processing performed after the plating processing on the substrate held by the first holder.

2 . The substrate processing apparatus of claim 1 , further comprising:
a controller configured to control an operation of the substrate processing apparatus, wherein the controller controls the module-outside transfer device to carry the substrate into the first liquid processing device, the module-inside transfer device to transfer the substrate from the first liquid processing device to the second liquid processing device, the second liquid processing device to perform the plating processing on the substrate by supplying a plating liquid onto the substrate and heating the plating liquid, the module-inside transfer device to transfer the substrate from the second liquid processing device to the first liquid processing device, the first liquid processing device to perform the post-cleaning processing on the substrate, and the module-outside transfer device to carry the substrate out from the liquid processing module.

3 . The substrate processing apparatus of claim 2 ,
wherein the controller controls the first liquid processing device to perform a pre-processing including a pre-cleaning process performed before the plating processing on the substrate, after the substrate is carried into the first liquid processing device by the module-outside transfer device and before the substrate is transferred from the first liquid processing device to the second liquid processing device by the module-inside transfer device.

4 . The substrate processing apparatus of claim 1 , further comprising:
a controller configured to control an operation of the substrate processing apparatus, wherein the controller controls the module-outside transfer device to carry the substrate into the first liquid processing device, the first liquid processing device to perform a pre-processing including a pre-cleaning process performed before the plating processing on the substrate, the module-inside transfer device to transfer the substrate from the first liquid processing device to the second liquid processing device, the second liquid processing device to perform a first plating processing on the substrate by supplying a plating liquid onto the substrate and heating the plating liquid, the module-inside transfer device to transfer the substrate from the second liquid processing device to the first liquid processing device, the first liquid processing device to perform an intermediate cleaning processing on the substrate, the module-inside transfer device to transfer the substrate from the first liquid processing device to the second liquid processing device, the second liquid processing device to perform a second plating processing on the substrate by supplying a plating liquid onto the substrate and heating the plating liquid, the module-inside transfer device to transfer the substrate from the second liquid processing device to the first liquid processing device, the first liquid processing device to perform the post-cleaning processing on the substrate, and the module-outside transfer device to carry the substrate out from the liquid processing module.

5 . The substrate processing apparatus of claim 3 ,
wherein the pre-processing includes a palladium imparting process of imparting palladium to the substrate.

6 . The substrate processing apparatus of claim 2 ,
wherein the second holder of the second liquid processing device is provided with a heater, and when the plating processing is performed on the substrate, the substrate and the plating liquid are heated by the heater.

7 . The substrate processing apparatus of claim 2 ,
wherein the second liquid processing device is provided with a top plate and a top plate moving mechanism, and when the plating processing is performed on the substrate, the controller controls the top plate to cover the substrate held by the second holder and supplied with the plating liquid.

8 . The substrate processing apparatus of claim 7 ,
wherein the top plate is provided with a heater, and when the plating processing is performed on the substrate, the controller controls the heater to heat at least a bottom surface of the top plate.

9 . The substrate processing apparatus of claim 7 ,
wherein the top plate is provided with an inert gas supply, and when the plating processing is performed on the substrate, the controller controls the inert gas supply to supply an inert gas into at least a space between the top plate and the substrate.

10 . The substrate processing apparatus of claim 7 ,
wherein an inert gas supply is provided at a peripheral portion of the second holder of the second liquid processing device, and when the plating processing is performed on the substrate, the controller controls the inert gas supply to supply an inert gas into at least a space between the top plate and the substrate.

11 . The substrate processing apparatus of claim 7 , further comprising:
an inert gas supply configured to supply an inert gas to the second liquid processing device, wherein at least when the plating processing is performed on the substrate, the controller controls the inert gas supply to supply the inert gas to a space within the second liquid processing device.

12 . A substrate processing method, comprising:
providing a substrate processing apparatus which includes: a liquid processing module, provided with a carry-out/in opening of a substrate, including therein a first liquid processing device and a second liquid processing device provided at a position farther from the carry-out/in opening than the first liquid processing device; a module-outside transfer device configured to carry the substrate out from and into the liquid processing module; and a module-inside transfer device configured to transfer the substrate between the first liquid processing device and the second liquid processing device, the first liquid processing device being equipped with a first holder configured to hold the substrate and the second liquid processing device being equipped with a second holder configured to hold the substrate; carrying the substrate into the first liquid processing device by the module-outside transfer device; transferring the substrate from the first liquid processing device to the second liquid processing device by the module-inside transfer device; performing a plating processing on the substrate by the second liquid processing device while supplying a plating liquid onto the substrate and heating the plating liquid; transferring the substrate from the second liquid processing device to the first liquid processin

Assignees

• Tokyo Electron Ltd

Inventors

• Morikawa Katsuhiro
• Akimoto Masami
• Iwashita Mitsuaki
• Kaneko Satoshi

Classifications

• H10P72/3306

  Horizontal transfer of a single workpiece · CPC title

• H10P72/0476 Primary

  comprising at least one plating chamber · CPC title

• H10P70/27

  during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers · CPC title

• H10P14/46

  using a liquid · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title